PIC16LC642-04/SO Microchip Technology, PIC16LC642-04/SO Datasheet - Page 113

• Manufacturer Part Number: PIC16LC642-04/SO
• Description: IC MCU OTP 4KX14 COMP 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16LC642-04/SO

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Peripherals: Brown-out Detect/Reset, LED, POR, WDT
• Number Of I /o: 22
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: OTP
• Ram Size: 176 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 6 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 28-SOIC (7.5mm Width)
• Processor Series: PIC16LC
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 176 B
• Interface Type: RS- 232
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 8
• Operating Supply Voltage: 3 V to 6 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: 0 C
• On-chip Adc: 10 bit
• Data Rom Size: 176 B
• Height: 2.31 mm
• Length: 17.87 mm
• Supply Voltage (max): 6 V
• Supply Voltage (min): 3 V
• Width: 7.49 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

14.2
1996 Microchip Technology Inc.
*Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask rev#, and
assembly code. For OTP marking beyond this, certain price adders apply. Please check with your Microchip
Sales Office. For QTP devices, any special marking adders are included in QTP price.
Legend: MM...MMicrochip part number information
XX...X
AA
BB
C
D
E
Note:In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next
line thus limiting the number of available characters for customer specific information.
40-Lead PDIP
44-Lead PLCC
44-Lead TQFP
40-Lead CERDIP Windowed
Package Marking Information
MMMMMMMM
XXXXXXXXXX
XXXXXXXXXX
MMMMMMMMMMMMMM
XXXXXXXXXXXXXXXXXX
AABBCDE
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
C = Chandler, Arizona, U.S.A.
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
AABBCDE
MMMMMMMM
XXXXXXXXXX
XXXXXXXXXX
AABBCDE
MMMMMMMMM
XXXXXXXXXXX
XXXXXXXXXXX
AABBCDE
Preliminary
PIC16C64X & PIC16C66X
Example
Example
Example
Example
PIC16C662
-20/TQ
PIC16C662-04/P
AABBCDE
AABBCDE
PIC16C662
-20/L
9512CAA
PIC16C662/JW
AABBCDE
DS30559A-page 113