PIC16C642-04I/SO Microchip Technology, PIC16C642-04I/SO Datasheet - Page 58

• Manufacturer Part Number: PIC16C642-04I/SO
• Description: IC MCU OTP 4KX14 COMP 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C642-04I/SO

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Peripherals: Brown-out Detect/Reset, LED, POR, WDT
• Number Of I /o: 22
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: OTP
• Ram Size: 176 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Processor Series: PIC16C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 176 B
• Interface Type: RS- 232
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 33
• Number Of Timers: 8
• Operating Supply Voltage: 3 V to 6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• Data Rom Size: 176 B
• Height: 2.05 mm
• Length: 17.9 mm
• Supply Voltage (max): 6 V
• Supply Voltage (min): 4 V
• Width: 7.5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

PIC16C64X & PIC16C66X
9.2.3
Either a prepackaged oscillator can be used or a simple
oscillator circuit with TTL gates can be built. Prepack-
aged oscillators provide a wide operating range and
better stability. A well-designed crystal oscillator will
provide good performance with TTL gates. Two types
of crystal oscillator circuits can be used: one with series
resonance, or one with parallel resonance.
Figure 9-4 shows implementation of a parallel resonant
oscillator circuit. The circuit is designed to use the fun-
damental frequency of the crystal. The 74AS04 inverter
performs the 180-degree phase shift that a parallel
oscillator requires. The 4.7 k
negative feedback for stability. The 10 k
ter biases the 74AS04 in the linear region. This could
be used for external oscillator designs.
FIGURE 9-4:
Figure 9-5 shows a series resonant oscillator circuit.
This circuit is also designed to use the fundamental fre-
quency of the crystal. The inverter performs a
180-degree phase shift in a series resonant oscillator
circuit. The 330 k resistors provide the negative feed-
back to bias the inverters in their linear region.
FIGURE 9-5:
DS30559A-page 58
74AS04
330 k
10k
EXTERNAL CRYSTAL OSCILLATOR
CIRCUIT
+5V
0.1 F
XTAL
20 pF
10k
74AS04
XTAL
EXTERNAL PARALLEL
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
EXTERNAL SERIES
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
4.7k
74AS04
330 k
20 pF
10k
74AS04
74AS04
resistor provides the
To Other
Devices
To Other
Devices
potentiome-
PIC16CXXX
PIC16CXXX
CLKIN
CLKIN
Preliminary
9.2.4
For timing insensitive applications the “RC” device
option offers additional cost savings. The RC oscillator
frequency is a function of the supply voltage, the resis-
tor (Rext) and capacitor (Cext) values, and the operat-
ing temperature. In addition to this, the oscillator
frequency will vary from unit to unit due to normal pro-
cess parameter variation. Furthermore, the difference
in lead frame capacitance between package types will
also affect the oscillation frequency, especially for low
Cext values. The user also needs to take into account
variation due to tolerance of external R and C compo-
nents used. Figure 9-6 shows how the R/C combina-
tion is connected to the PIC16CXXX. For Rext values
below 2.2 k , the oscillator operation may become
unstable, or stop completely. For very high Rext values
(e.g. 1 M ), the oscillator becomes sensitive to noise,
humidity and leakage. Thus, we recommend to keep
Rext between 3 k and 100 k .
Although the oscillator will operate with no external
capacitor (Cext = 0 pF), we recommend using values
above 20 pF for noise and stability reasons. With no or
small external capacitance, the oscillation frequency
can vary dramatically due to changes in external
capacitances, such as PCB trace capacitance or pack-
age lead frame capacitance.
See characterization data for desired device for RC fre-
quency variation from part to part due to normal pro-
cess variation. The variation is larger for larger R (since
leakage current variation will affect RC frequency more
for large R) and for smaller C (since variation of input
capacitance will affect RC frequency more).
See characterization data for desired device for varia-
tion of oscillator frequency due to V
Cext values as well as frequency variation due to oper-
ating temperature for given R, C, and V
The oscillator frequency, divided by 4, is available on
the OSC2/CLKOUT pin, and can be used for test pur-
poses or to synchronize other logic (see Figure 3-3 for
waveform).
FIGURE 9-6:
Cext
Rext
V
SS
V
DD
RC OSCILLATOR
Fosc/4
RC OSCILLATOR MODE
OSC1
OSC2/CLKOUT
1996 Microchip Technology Inc.
DD
DD
for given Rext/
PIC16CXXX
values.
Internal
clock