PIC16C56-XT/P Microchip Technology, PIC16C56-XT/P Datasheet - Page 176
![IC MCU OTP 1KX12 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
PIC16C56-XT/P
Manufacturer Part Number
PIC16C56-XT/P
Description
IC MCU OTP 1KX12 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheet
1.PIC16LC58B-04P.pdf
(194 pages)
Specifications of PIC16C56-XT/P
Program Memory Type
OTP
Program Memory Size
1.5KB (1K x 12)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
12
Ram Size
25 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 6.25 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Processor Series
PIC16C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
25 B
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
12
Number Of Timers
1
Operating Supply Voltage
2 V to 6.25 V
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
0 C
Controller Family/series
PIC16C
No. Of I/o's
12
Eeprom Memory Size
1KB
Ram Memory Size
25Byte
Cpu Speed
20MHz
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
309-1059 - ADAPTER 18 ZIF BD W/18SO PLUGSAC164001 - MODULE SKT PROMATEII 18/28DIP
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16C56-XT/P
Manufacturer:
Microchip Technology
Quantity:
1 100
Part Number:
PIC16C56-XT/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC16C5X
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP)
DS30453D-page 174
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
eB
A1
E1
B1
E
D
B
n
p
A
L
c
MIN
1.345
Preliminary
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
28
10
10
MAX
1.385
.135
.325
.295
.135
.015
.065
.160
.022
.430
15
15
MIN
34.16
3.56
3.18
0.38
7.62
6.99
3.18
0.20
1.02
8.13
0.41
5
5
MILLIMETERS
2002 Microchip Technology Inc.
p
NOM
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
28
10
10
A2
L
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15