PIC16F73-I/ML Microchip Technology, PIC16F73-I/ML Datasheet - Page 158

• Manufacturer Part Number: PIC16F73-I/ML
• Description: IC MCU FLASH 4KX14 A/D 28QFN
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F73-I/ML

• Core Size: 8-Bit
• Program Memory Size: 7KB (4K x 14)
• Oscillator Type: External
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Type: FLASH
• Ram Size: 192 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x8b
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Controller Family/series: PIC16F
• No. Of I/o's: 22
• Ram Memory Size: 192Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• No. Of Pwm: RoHS Compliant
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 192 B
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 3 bit
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28QFN4 - SOCKET TRANS ICE 28QFN W/CABLEAC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: PIC16F73I/ML

PIC16F7X
28-Lead Plastic Micro Leadframe Package (MF) 6x6 mm Body (MLF)
DS30325B-page 156
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-114
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Width
Molded Package Width
Exposed Pad Width
Overall Length
Molded Package Length
Exposed Pad Length
Lead Width
Lead Length
Tie Bar Width
Tie Bar Length
Chamfer
Mold Draft Angle Top
A1
CH x 45
TOP VIEW
E1
E
Dimension Limits
n
Units
CH
A2
A1
A3
E1
E2
D1
D2
A
E
D
B
R
Q
n
p
L
2
1
MIN
D1
A2
.000
.140
.140
.009
.020
.005
.012
.009
D
A3
.008 REF.
INCHES
.026 BSC
.236 BSC
.226 BSC
.236 BSC
.226 BSC
A
NOM
D2
.0004
.033
.026
.146
.146
.011
.024
.007
.016
.017
28
R
EXPOSED
MAX
METAL
.039
.031
.002
.152
.152
.014
.030
.010
.026
.024
PADS
12
BOTTOM VIEW
MIN
E2
0.00
3.55
3.55
0.23
0.50
0.13
0.30
0.24
MILLIMETERS*
2002 Microchip Technology Inc.
0.20 REF.
0.65 BSC
6.00 BSC
5.75 BSC
6.00 BSC
5.75 BSC
NOM
0.85
0.65
0.01
3.70
3.70
0.28
0.60
0.17
0.40
0.42
L
28
MAX
Q
B
p
1.00
0.80
0.05
3.85
3.85
0.35
0.75
0.23
0.65
0.60
12