DSPIC33FJ32MC204-I/PT Microchip Technology, DSPIC33FJ32MC204-I/PT Datasheet - Page 312

• Manufacturer Part Number: DSPIC33FJ32MC204-I/PT
• Description: IC DSPIC MCU/DSP 32K 44TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ32MC204-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 44-TQFP, 44-VQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 35
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 9x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 35
• Data Ram Size: 2 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240002, DM330011, DM330021, MA330017
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304
TABLE A-6:
DS70283H-page 312
Section 24.0 “Electrical Characteristics”
Section 25.0 “High Temperature Electrical
Characteristics”
Section 26.0 “Packaging Information”
“Product Identification System”
Section Name
MAJOR SECTION UPDATES (CONTINUED)
Added the 28-pin SSOP Thermal Packaging Characteristics (see
Table
Removed Note 4 from the DC Temperature and Voltage
Specifications (see
Updated the maximum value for parameter DI19 and added
parameters DI28, DI29, DI60a, DI60b, and DI60c to the I/O Pin Input
Specifications (see
Updated Note 3 of the PLL Clock Timing Specifications (see
Table
Removed Note 2 from the AC Characteristics: Internal RC Accuracy
(see
Updated the characteristic description for parameter DI35 in the I/O
Timing Requirements (see
Updated all SPI specifications (see
and
Added Note 4 to the 12-bit mode ADC Module Specifications (see
Table
Added Note 4 to the 10-bit mode ADC Module Specifications (see
Table
Updated all ambient temperature and range values to +150ºC
throughout the chapter.
Updated the storage temperature and range to +160ºC.
Updated the maximum junction temperature from +145ºC to +155ºC.
Updated Note 1 in the PLL Clock Timing Specifications (see
Table
Added Note 3 to the 12-bit Mode ADC Module Specifications (see
Table
Added Note 3 to the 10-bit Mode ADC Module Specifications (see
Table
Added the 28-Lead SSOP package information (see
“Package Marking Information”
Details”).
Added the “SS” definition for the SSOP package.
Figure 24-14
Table
24-3).
24-17).
24-43).
24-44).
25-10).
25-17).
25-18).
24-18).
through
Table
Table
Update Description
24-4).
24-9).
Figure
Table
24-20).
24-21).
and
Table 24-32
© 2011 Microchip Technology Inc.
Section 26.2 “Package
through
Section 26.1
Table 24-39