PIC18F4525-E/ML Microchip Technology, PIC18F4525-E/ML Datasheet - Page 25
PIC18F4525-E/ML
Manufacturer Part Number
PIC18F4525-E/ML
Description
IC MCU FLASH 24KX16 44QFN
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18F2221-ISO.pdf
(46 pages)
2.PIC18F2525-ISO.pdf
(412 pages)
3.PIC18F2525-ISO.pdf
(18 pages)
4.PIC18F2525-ISO.pdf
(18 pages)
5.PIC18F2525-ISO.pdf
(6 pages)
6.PIC18F2525-ISO.pdf
(6 pages)
Specifications of PIC18F4525-E/ML
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
36
Program Memory Size
48KB (24K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 13x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
44-QFN
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3986 B
Interface Type
SPI, I2C, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
36
Number Of Timers
1 x 8
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, 53275-917, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
13 bit
For Use With
I3DB18F4620 - BOARD DAUGHTER ICEPIC3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- PIC18F2221-ISO PDF datasheet
- PIC18F2525-ISO PDF datasheet #2
- PIC18F2525-ISO PDF datasheet #3
- PIC18F2525-ISO PDF datasheet #4
- PIC18F2525-ISO PDF datasheet #5
- PIC18F2525-ISO PDF datasheet #6
- Current page: 25 of 412
- Download datasheet (7Mb)
2.0
2.1
PIC18F2525/2620/4525/4620 devices can be operated
in ten different oscillator modes. The user can program
the Configuration bits, FOSC3:FOSC0, in Configuration
Register 1H to select one of these ten modes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. ECIO
2.2
In XT, LP, HS or HSPLL Oscillator modes, a crystal or
ceramic resonator is connected to the OSC1 and
OSC2 pins to establish oscillation. Figure 2-1 shows
the pin connections.
The oscillator design requires the use of a parallel cut
crystal.
© 2008 Microchip Technology Inc.
Note:
LP
XT
HS
HSPLL High-Speed Crystal/Resonator
RC
RCIO
INTIO1 Internal Oscillator with F
INTIO2 Internal Oscillator with I/O on RA6
EC
OSCILLATOR
CONFIGURATIONS
Oscillator Types
Crystal Oscillator/Ceramic
Resonators
Use of a series cut crystal may give a fre-
quency out of the crystal manufacturer’s
specifications.
Low-Power Crystal
Crystal/Resonator
High-Speed Crystal/Resonator
with PLL Enabled
External Resistor/Capacitor with
F
External Resistor/Capacitor with I/O
on RA6
on RA6 and I/O on RA7
and RA7
External Clock with F
External Clock with I/O on RA6
OSC
/4 Output on RA6
OSC
OSC
/4 Output
/4 Output
PIC18F2525/2620/4525/4620
FIGURE 2-1:
TABLE 2-1:
Capacitor values are for design guidance only.
Different capacitor values may be required to produce
acceptable oscillator operation. The user should test
the performance of the oscillator over the expected
V
See the notes following Table 2-2 for additional
information.
Note 1: See Table 2-1 and Table 2-2 for initial values of
DD
Mode
XT
and temperature range for the application.
C1
C2
2: A series resistor (R
3: R
(1)
(1)
Typical Capacitor Values Used:
C1 and C2.
strip cut crystals.
F
3.58 MHz
4.19 MHz
XTAL
R
varies with the oscillator mode chosen.
4 MHz
4 MHz
S
Freq
(2)
CAPACITOR SELECTION FOR
CERAMIC RESONATORS
OSC2
OSC1
CRYSTAL/CERAMIC
RESONATOR OPERATION
(XT, LP, HS OR HSPLL
CONFIGURATION)
S
OSC1
15 pF
15 pF
30 pF
50 pF
) may be required for AT
R
F
(3)
DS39626E-page 23
PIC18FXXXX
Sleep
To
OSC2
15 pF
15 pF
30 pF
50 pF
Internal
Logic
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