DSPIC33FJ32MC302-I/SP Microchip Technology, DSPIC33FJ32MC302-I/SP Datasheet - Page 418

IC DSPIC MCU/DSP 32K 28DIP

DSPIC33FJ32MC302-I/SP

Manufacturer Part Number
DSPIC33FJ32MC302-I/SP
Description
IC DSPIC MCU/DSP 32K 28DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr

Specifications of DSPIC33FJ32MC302-I/SP

Program Memory Type
FLASH
Program Memory Size
32KB (32K x 8)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
21
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Data Ram Size
4 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Minimum Operating Temperature
- 40 C
Package
28SPDIP
Device Core
dsPIC
Family Name
dSPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Interface Type
I2C/SPI/UART
On-chip Adc
6-chx10-bit|6-chx12-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC33FJ32MC302-I/SP
Manufacturer:
Microchip Technology
Quantity:
135
Part Number:
DSPIC33FJ32MC302-I/SP
Manufacturer:
MICROCHIP
Quantity:
12 000
dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04
TABLE A-1:
DS70291E-page 418
Section 30.0 “Electrical Characteristics”
Section Name
MAJOR SECTION UPDATES (CONTINUED)
Updated Max MIPS for temperature range of -40ºC to +125ºC in
Table 30-1
Updated typical values in Thermal Packaging Characteristics in
Table 30-3
Added parameters DI11 and DI12 to Table 30-9
Updated minimum values for parameters D136 (T
(T
Added Extended temperature range to Table 30-13
Updated Note 2 in Table 30-38
Updated parameter AD63 and added Note 3 to Table 30-42 and
Table 30-43
PE
) and removed typical values in Table 30-12
Update Description
© 2011 Microchip Technology Inc.
RW
) and D137

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