PIC18LF252-I/SOG Microchip Technology, PIC18LF252-I/SOG Datasheet - Page 11

• Manufacturer Part Number: PIC18LF252-I/SOG
• Description: IC MCU FLASH 16KX16 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18LF252-I/SOG

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 23
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

FIGURE 3:
© 2005 Microchip Technology Inc.
44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)
A1
*Controlling Parameter
Notes:
JEDEC equivalent: M0-220
Drawing No. C04-103
1. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. REF: Reference Dimension, usually without tolerance, for information purposes only.
Number of Contacts
Pitch
Overall Height
Standoff
Base Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
See ASME Y14.5M
See ASME Y14.5M
44-PIN QFN PACKAGE
OPTIONAL PIN 1
TOP MARKING
INDEX ON
Dimension Limits
TOP VIEW
E
DETAIL: CONTACT VARIANTS
(PROFILE MAY VARY)
Units
D2
E2
A3
A1
n
p
A
E
D
B
L
n
EXPOSED PAD
MIN
2
1
.000
.246
.246
.008
.014
.309
.309
.031
INDEX ON
A3
D
.026 BSC
PIN 1
.010 REF
A
INCHES
NOM
D2
.035
.315
.268
.315
.268
.013
.016
.001
44
1
2
EXPOSED
MAX
.002
.274
.274
.013
.039
.019
METAL
.321
.321
BOTTOM VIEW
PAD
MIN
E2
0.80
7.85
6.25
7.85
6.25
0.20
0.35
0
MILLIMETERS*
0.65 BSC
0.25 REF
NOM
PIC18FXX2
0.90
0.02
8.00
6.80
8.00
6.80
0.33
0.40
Revised 3-14-05
44
L
1
2
MAX
DS80127G-page 11
B
1.00
0.05
8.15
6.95
8.15
6.95
0.35
0.48
p