PIC16F84A-04I/SO Microchip Technology, PIC16F84A-04I/SO Datasheet - Page 74

• Manufacturer Part Number: PIC16F84A-04I/SO
• Description: IC MCU FLASH 1KX14 EE 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F84A-04I/SO

• Core Size: 8-Bit
• Program Memory Size: 1.75KB (1K x 14)
• Core Processor: PIC
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 13
• Program Memory Type: FLASH
• Eeprom Size: 64 x 8
• Ram Size: 68 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 18-SOIC (7.5mm Width)
• Controller Family/series: PIC16F
• No. Of I/o's: 13
• Eeprom Memory Size: 64Byte
• Ram Memory Size: 68Byte
• Cpu Speed: 4MHz
• No. Of Timers: 1
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 68 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 13
• Number Of Timers: 8
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILI3-DB16F84A - BOARD DAUGHTER ICEPIC3309-1075 - ADAPTER 18-SOIC TO 18-SOIC309-1011 - ADAPTER 18-SOIC TO 18-DIP309-1010 - ADAPTER 18-SOIC TO 18-DIPAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

PIC16F84A
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS35007B-page 72
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
n
E1
E
eB
Dimension Limits
2
1
§
D
c
Units
eB
A2
A1
E1
B1
D
n
p
A
E
L
c
B
MIN
A1
A
.140
.115
.015
.300
.240
.890
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.898
.130
.012
.058
.018
.370
18
10
10
B
B1
MAX
.170
.145
.325
.260
.905
.135
.015
.070
.430
.022
15
15
MIN
22.61
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
NOM
2001 Microchip Technology Inc.
p
22.80
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
18
10
10
MAX
A2
L
22.99
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15