PIC16F876-04E/SO Microchip Technology, PIC16F876-04E/SO Datasheet - Page 23
![IC MCU FLASH 8KX14 EE 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC16F876-04E/SO
Manufacturer Part Number
PIC16F876-04E/SO
Description
IC MCU FLASH 8KX14 EE 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16C770-ISO.pdf
(8 pages)
4.PIC16F873-04SO.pdf
(218 pages)
5.PIC16F873-04SO.pdf
(5 pages)
6.PIC16F873-04SO.pdf
(5 pages)
Specifications of PIC16F876-04E/SO
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
14KB (8K x 14)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
28-SOIC (7.5mm Width)
Core
PIC
Processor Series
PIC16F
Data Bus Width
8 bit
Maximum Clock Frequency
20 MHz
Data Ram Size
368 B
Data Rom Size
256 B
On-chip Adc
Yes
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Mounting Style
SMD/SMT
A/d Bit Size
10 bit
A/d Channels Available
5
Height
2.31 mm
Interface Type
MSSP, PSP, USART
Length
17.87 mm
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4 V
Width
7.49 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
PIC16F87604E/SO
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16C770-ISO PDF datasheet #3
- PIC16F873-04SO PDF datasheet #4
- PIC16F873-04SO PDF datasheet #5
- PIC16F873-04SO PDF datasheet #6
- Current page: 23 of 688
- Download datasheet (3Mb)
1.5.3.8
1.5.3.9
1.5.3.10
1.5.3.11
1.5.3.12
1997 Microchip Technology Inc.
ROM Devices
DIE
Specialized Services
Quick Turn Production (QTP) Programming
Serialized Quick Turn Production (SQTP
ROM devices have their program memory fixed at the time of the silicon manufacture. Since the
program memory cannot be changed, the device can be housed in the lower cost plastic pack-
age.
The DIE option allows the board size to become as small as physically possible. The DIE Support
document (DS30258) explains general information about using and designing with DIE. There
are also individual specification sheets that detail DIE specific information. Manufacturing with
DIE requires special knowledge and equipment. This means that the number of manufacturing
houses that support DIE will be limited. If you decide to use the DIE option, please research your
manufacturing sites to ensure that they will be able to meet the specialized requirements of DIE
use.
For OTP customers with established code, Microchip offers two specialized services. These two
services, Quick Turn Production Programming and Serialized Quick Turn Production Program-
ming, that allow customers to shorten their manufacturing cycle time.
Microchip offers this programming service for factory production orders. This service is made
available for users who choose not to program a medium to high quantity of units and whose code
patterns have stabilized. The devices are identical to the OTP devices but with all EPROM loca-
tions and configuration options already programmed by the factory. Certain code and prototype
verification procedures apply before production shipments are available. Please contact your
local Microchip sales office for more details.
Microchip offers a this unique programming service where a few user-defined locations in each
device are programmed with different serial numbers. The serial numbers may be random,
pseudo-random or sequential.
Serial programming allows each device to have a unique number which can serve as an
entry-code, password or ID number.
SM
) Programming
Section 1. Introduction
DS31001A-page 1-11
1
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