PIC16F77-I/P Microchip Technology, PIC16F77-I/P Datasheet - Page 331
![IC MCU FLASH 8KX14 A/D 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC16F77-I/P
Manufacturer Part Number
PIC16F77-I/P
Description
IC MCU FLASH 8KX14 A/D 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F73-ISP.pdf
(174 pages)
5.PIC16F73-ISP.pdf
(14 pages)
6.PIC16F73-ISP.pdf
(12 pages)
Specifications of PIC16F77-I/P
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
I2C/SPI/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
33
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 8-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
444-1001 - DEMO BOARD FOR PICMICRO MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
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Part Number
Manufacturer
Quantity
Price
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Part Number:
PIC16F77-I/P
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AVX
Quantity:
84 000
Company:
Part Number:
PIC16F77-I/P
Manufacturer:
MICROCHI
Quantity:
2 000
Company:
Part Number:
PIC16F77-I/PT
Manufacturer:
ADDTEK
Quantity:
20 000
Company:
Part Number:
PIC16F77-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC16F77-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F818-ISO PDF datasheet #3
- PIC16F73-ISP PDF datasheet #4
- PIC16F73-ISP PDF datasheet #5
- PIC16F73-ISP PDF datasheet #6
- Current page: 331 of 688
- Download datasheet (3Mb)
17.4.18.3 Bus Collision During a STOP Condition
1997 Microchip Technology Inc.
SDA
SCL
PEN
BCLIF
P
SSPIF
SSPIF
BCLIF
SDA
PEN
SCL
P
Bus collision occurs during a STOP condition if:
a)
b)
The STOP condition begins with SDA asserted low. When SDA is sampled low, the SCL pin is
allow to float. When the pin is sampled high (clock arbitration), the baud rate generator is loaded
with SSPADD<6:0> and counts down to 0. After the BRG times out SDA is sampled. If SDA is
sampled low, a bus collision has occurred. This is due to another master attempting to drive a
data '0'
collision occurs. This is another case of another master attempting to drive a data '0'
(Figure
Figure 17-40: Bus Collision During a STOP Condition (Case 1)
Figure 17-41: Bus Collision During a STOP Condition (Case 2)
After the SDA pin has been de-asserted and allowed to float high, SDA is sampled low
after the BRG has timed out.
After the SCL pin is de-asserted, SCL is sampled low before SDA goes high.
(Figure
17-41).
Assert SDA
T
SDA asserted low
BRG
17-40). If the SCL pin is sampled low before SDA is allowed to float high, a bus
T
BRG
Preliminary
T
BRG
T
BRG
Section 17. MSSP
SCL goes low before SDA goes high
Set BCLIF
T
BRG
T
BRG
DS31017A-page 17-55
'0'
'0'
SDA sampled
low after T
Set BCLIF
'0'
'0'
BRG
,
17
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