PIC18F6621-I/PTG Microchip Technology, PIC18F6621-I/PTG Datasheet - Page 377

IC PIC MCU FLASH 32KX16 64TQFP

PIC18F6621-I/PTG

Manufacturer Part Number
PIC18F6621-I/PTG
Description
IC PIC MCU FLASH 32KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F6621-I/PTG

Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
53
Program Memory Size
64KB (32K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.75K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
 2005 Microchip Technology Inc.
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-026
Drawing No. C04-092
c
B
*Controlling Parameter
Notes:
β
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .010" (0.254mm) per side.
p
Dimension Limits
#leads=n1
E1
E
Units
(F)
CH
n1
A2
E1
D1
A1
φ
E
D
B
α
n
p
A
L
c
β
PIC18F6525/6621/8525/8621
n
MIN
.037
.002
.018
.463
.463
.004
.007
.025
.039
.541
.541
2
1
5
5
0
D1
L
φ
CH x 45°
INCHES
D
NOM
80
.004
.024
.020
.043
.039
.039
.472
.472
.006
.009
.035
.551
.551
A1
3.5
20
10
10
A
MAX
.047
.006
.030
.482
.482
.008
.045
.011
.041
.561
.561
15
15
7
(F)
MIN
13.75
13.75
11.75
11.75
0.64
1.00
0.95
0.05
0.45
0.09
0.17
0
5
5
MILLIMETERS*
NOM
80
14.00
14.00
12.00
12.00
1.10
1.00
0.10
0.60
1.00
0.15
0.22
0.89
0.50
3.5
10
10
20
DS39612B-page 375
MAX
A2
14.25
14.25
12.25
12.25
0.20
0.27
1.14
1.20
1.05
0.15
0.75
α
15
15
7

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