PIC18F452-E/L Microchip Technology, PIC18F452-E/L Datasheet - Page 6

• Manufacturer Part Number: PIC18F452-E/L
• Description: IC MCU CMOS 40MHZ 16K FLSH44PLCC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F452-E/L

• Core Size: 8-Bit
• Program Memory Size: 32KB (16K x 16)
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 34
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 44-PLCC
• Controller Family/series: PIC18
• No. Of I/o's: 34
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 1.5KB
• Cpu Speed: 40MHz
• No. Of Timers: 4
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 1536 B
• Interface Type: MSSP, SPI, I2C, PSP, USART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 34
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT44L2 - SOCKET TRAN ICE 44PLCCDVA16XL441 - ADAPTER DEVICE ICE 44PLCC
• Lead Free Status / Rohs Status: Details

PIC18FXX2
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Timer0 Module ......................................................................................................................................................................... 103
11.0 Timer1 Module ......................................................................................................................................................................... 107
12.0 Timer2 Module ......................................................................................................................................................................... 111
13.0 Timer3 Module ......................................................................................................................................................................... 113
14.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 117
15.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 125
16.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (USART).............................................................. 165
17.0 Compatible 10-bit Analog-to-Digital Converter (A/D) Module................................................................................................... 181
18.0 Low Voltage Detect .................................................................................................................................................................. 189
19.0 Special Features of the CPU .................................................................................................................................................... 195
20.0 Instruction Set Summary .......................................................................................................................................................... 211
21.0 Development Support............................................................................................................................................................... 253
22.0 Electrical Characteristics .......................................................................................................................................................... 259
23.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 289
24.0 Packaging Information.............................................................................................................................................................. 305
Appendix A: Revision History ............................................................................................................................................................ 313
Appendix B: Device Differences........................................................................................................................................................ 313
Appendix C: Conversion Considerations........................................................................................................................................... 314
Appendix D: Migration from Baseline to Enhanced Devices ............................................................................................................. 314
Appendix E: Migration from Mid-range to Enhanced Devices........................................................................................................... 315
Appendix F: Migration from High-end to Enhanced Devices ............................................................................................................ 315
Index .................................................................................................................................................................................................. 317
On-Line Support................................................................................................................................................................................. 327
Reader Response .............................................................................................................................................................................. 328
PIC18FXX2 Product Identification System......................................................................................................................................... 329
DS39564C-page 4
Device Overview .......................................................................................................................................................................... 7
Oscillator Configurations ............................................................................................................................................................ 17
Reset .......................................................................................................................................................................................... 25
Memory Organization ................................................................................................................................................................. 35
FLASH Program Memory ........................................................................................................................................................... 55
Data EEPROM Memory ............................................................................................................................................................. 65
8 X 8 Hardware Multiplier ........................................................................................................................................................... 71
Interrupts .................................................................................................................................................................................... 73
I/O Ports ..................................................................................................................................................................................... 87
© 2006 Microchip Technology Inc.