PIC18LF2620-I/SP Microchip Technology, PIC18LF2620-I/SP Datasheet - Page 398

IC MCU FLASH 32KX16 28SDIP

PIC18LF2620-I/SP

Manufacturer Part Number
PIC18LF2620-I/SP
Description
IC MCU FLASH 32KX16 28SDIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18LF2620-I/SP

Program Memory Type
FLASH
Program Memory Size
64KB (32K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Eeprom Size
1K x 8
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3986 B
Interface Type
SPI/I2C/EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
25
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit
Package
28SPDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18LF2620-I/SP
Manufacturer:
Microchip Technology
Quantity:
1 989
Part Number:
PIC18LF2620-I/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC18F2525/2620/4525/4620
APPENDIX E:
A detailed discussion of the differences between the
mid-range MCU devices (i.e., PIC16CXXX) and the
Enhanced devices (i.e., PIC18FXXX) is provided in
AN716, “Migrating Designs from PIC16C74A/74B to
PIC18C442”. The changes discussed, while device
specific, are generally applicable to all mid-range to
Enhanced device migrations.
This Application Note is available as Literature Number
DS00716.
DS39626E-page 396
MIGRATION FROM
MID-RANGE TO
ENHANCED DEVICES
APPENDIX F:
A detailed discussion of the migration pathway and
differences between the high-end MCU devices (i.e.,
PIC17CXXX)
PIC18FXXX) is provided in AN726, “PIC17CXXX to
PIC18CXXX Migration”.
This Application Note is available as Literature Number
DS00726.
and
the
MIGRATION FROM
HIGH-END TO
ENHANCED DEVICES
© 2008 Microchip Technology Inc.
Enhanced
devices
(i.e.,

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