AT90USB1286-AU Atmel, AT90USB1286-AU Datasheet - Page 4
AT90USB1286-AU
Manufacturer Part Number
AT90USB1286-AU
Description
MCU AVR 128K FLASH 16MHZ 64TQFP
Manufacturer
Atmel
Series
AVR® 90USBr
Specifications of AT90USB1286-AU
Core Processor
AVR
Core Size
8-Bit
Speed
16MHz
Connectivity
EBI/EMI, I²C, SPI, UART/USART, USB, USB OTG
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
48
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TQFP, 64-VQFP
Controller Family/series
AVR USB
No. Of I/o's
48
Eeprom Memory Size
4KB
Ram Memory Size
8KB
Cpu Speed
20MHz
Rohs Compliant
Yes
Processor Series
AT90USBx
Core
AVR8
Data Bus Width
8 bit
Data Ram Size
8 KB
Interface Type
2-Wire, SPI, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
48
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR, EWAVR-BL
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATSTK525, ATAVRISP2, ATAVRONEKIT, AT90USBKEY, ATEVK525
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT90USB1286-AU
Manufacturer:
SOUTH
Quantity:
650
Part Number:
AT90USB1286-AU
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
Company:
Part Number:
AT90USB1286-AUR
Manufacturer:
Atmel
Quantity:
747
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1.1
2. Overview
4
Disclaimer
AT90USB64/128
(PDO/PCINT3/MISO) PB3
(INT.7/AIN.1/UVcon) PE7
(PDI/PCINT2/MOSI) PB2
Figure 1-2.
Note:
Typical values contained in this datasheet are based on simulations and characterization of
other AVR microcontrollers manufactured on the same process technology. Min and Max values
will be available after the device is characterized.
The AT90USB64/128 is a low-power CMOS 8-bit microcontroller based on the AVR enhanced
RISC architecture. By executing powerful instructions in a single clock cycle, the
(PCINT6/OC.1B) PB6
(PCINT4/OC.2A) PB4
(PCINT5/OC.1A) PB5
(PCINT1/SCLK) PB1
(INT.6/AIN.0) PE6
(SS/PCINT0) PB0
The large center pad underneath the MLF packages is made of metal and internally connected to
GND. It should be soldered or glued to the board to ensure good mechanical stability. If the center
pad is left unconnected, the package might loosen from the board.
(IUID) PE3
UGnd
UCap
UVcc
VBus
Pinout AT90USB64/128-QFN
D+
D-
10
11
12
13
14
15
16
3
1
2
4
5
6
7
8
9
(64-lead QFN top view)
AT90USB128/64
INDEX CORNER
46
48
47
45
44
43
42
41
40
39
38
37
36
35
34
33
PA3 (AD3)
PA4 (AD4)
PA5 (AD5)
PA6 (AD6)
PA7 (AD7)
PE2 (ALE/HWB)
PC7 (A15/IC.3/CLKO)
PC6 (A14/OC.3A)
PC5 (A13/OC.3B)
PC4 (A12/OC.3C)
PC3 (A11/T.3)
PC2 (A10)
PC1 (A9)
PC0 (A8)
PE1 (RD)
PE0 (WR)
7593K–AVR–11/09
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