PIC32MX795F512L-80I/PF Microchip Technology, PIC32MX795F512L-80I/PF Datasheet - Page 41
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PIC32MX795F512L-80I/PF
Manufacturer Part Number
PIC32MX795F512L-80I/PF
Description
IC MCU 32BIT 512KB FLASH 100TQFP
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Datasheets
1.PIC32MX320F032H-40IPT.pdf
(66 pages)
2.PIC32MX575F256H-80IMR.pdf
(2 pages)
3.PIC32MX575F256H-80IMR.pdf
(254 pages)
4.PIC32MX575F256H-80IMR.pdf
(14 pages)
5.PIC32MX575F256H-80IPT.pdf
(240 pages)
Specifications of PIC32MX795F512L-80I/PF
Core Size
32-Bit
Program Memory Size
512KB (512K x 8)
Core Processor
MIPS32® M4K™
Speed
80MHz
Connectivity
CAN, Ethernet, I²C, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
85
Program Memory Type
FLASH
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP
Controller Family/series
PIC32
Ram Memory Size
128KB
Cpu Speed
80MHz
No. Of Timers
5
Interface
CAN, I2C, SPI, UART, USB
No. Of Pwm Channels
5
Embedded Interface Type
CAN, I2C, SPI, UART, USB
Rohs Compliant
Yes
Processor Series
PIC32MX7xx
Core
MIPS
3rd Party Development Tools
52713-733, 52714-737
Development Tools By Supplier
PG164130, DV164035, DV244005
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC32MX795F512L-80I/PF
Manufacturer:
TOSHIBA
Quantity:
4 600
Company:
Part Number:
PIC32MX795F512L-80I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC32MX795F512L-80I/PF
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
2.0
2.1
Getting started with the PIC32MX5XX/6XX/7XX family
of 32-bit Microcontrollers (MCUs) requires attention to
a minimal set of device pin connections before pro-
ceeding with development. The following is a list of pin
names, which must always be connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins–used for In-Circuit Serial
• OSC1 and OSC2 pins–when external oscillator
The following pin may be required, as well:
V
for ADC module is implemented
© 2010 Microchip Technology Inc.
REF
is not used
Programming (ICSP™) and debugging purposes
source is used
Note:
Note 1: This data sheet summarizes the features
CAP
(see
(see
(see
Voltage Regulator (V
(see
(see
(see
+/V
DD
/V
REF
DD
2: Some registers and associated bits
GUIDELINES FOR GETTING
STARTED WITH 32-BIT
MICROCONTROLLERS
Basic Connection Requirements
Section 2.2 “Decoupling
Section 2.2 “Decoupling
CORE
Section 2.4 “Master Clear (MCLR)
Section 2.5 “ICSP
Section 2.8 “External Oscillator
and V
Section 2.3 “Capacitor on Internal
and AV
- pins – used when external voltage reference
The AV
connected, regardless of ADC use and
the ADC voltage reference source.
of the PIC32MX5XX/6XX/7XX family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to the related section of the
“PIC32 Family Reference Manual”, which
is available from the Microchip web site
(www.microchip.com/PIC32).
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
this data sheet for device-specific register
and bit information.
pin
SS
SS
pins
DD
pins–even if the ADC module
and AV
CAP
Pins”)
/V
CORE
SS
Capacitors”)
Capacitors”)
)”)
pins must be
Pins”)
Pin”)
in
PIC32MX5XX/6XX/7XX
2.2
The use of decoupling capacitors on power supply
pins, such as V
See
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: A value of 0.1 µF
• Placement on the printed circuit board: The
• Handling high frequency noise: If the board is
• Maximizing performance: On the board layout
(100 nF), 10-20V is recommended. The capacitor
should be a low Equivalent Series Resistance
(low-ESR) capacitor and have resonance fre-
quency in the range of 20 MHz and higher. It is
further recommended that ceramic capacitors be
used.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended that
the capacitors be placed on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within one-
quarter inch (6 mm) in length.
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
Figure
Decoupling Capacitors
2-1.
DD
, V
SS
, AV
DD
and AV
DS61156F-page 41
SS
is required.