AT91M55800A-33AU Atmel, AT91M55800A-33AU Datasheet - Page 24

• Manufacturer Part Number: AT91M55800A-33AU
• Description: IC ARM MCU 33MHZ 176-LQFP
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91M55800A-33AU

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, SPI, UART/USART
• Peripherals: POR, WDT
• Number Of I /o: 58
• Program Memory Type: ROMless
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 176-LQFP
• Cpu Family: 91M
• Device Core: ARM7TDMI
• Device Core Size: 32b
• Frequency (max): 33MHz
• Interface Type: EBI/SPI/USART
• Program Memory Size: Not Required
• Total Internal Ram Size: 8KB
• # I/os (max): 58
• Number Of Timers - General Purpose: 6
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 8-chx10-bit
• On-chip Dac: 2-chx8-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 176
• Package Type: LQFP
• Processor Series: AT91Mx
• Core: ARM7TDMI
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Maximum Clock Frequency: 33 MHz
• Number Of Programmable I/os: 58
• Number Of Timers: 10 bit
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: AT91EB55
• Minimum Operating Temperature: - 40 C
• For Use With: AT91EB55 - KIT EVAL FOR ARM AT91M55800A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Compliant

Figure 9-2.
Table 9-4.
24
606
AT91M55800A Summary
176-ball Ball Grid Array Package Drawing
Device and 176-ball BGA Package Maximum Weight
Top View
mg
Notes:
Symbol
1. Package dimensions conform to
2. Dimensioning and tolerancing per
3. All dimensions in mm
4. Solder Ball position designation
5. Primary datum Z and seating
aaa
bbb
ddd
eee
ggg
hhh
kkk
fff
JEDEC MO-205
ASME Y14.5M-1994
per JESD 95-1, SPP-010
plane are defined by the spherical
crowns of the solder balls
Bottom View
Maximum
0.03
0.04
0.03
0.1
0.1
0.1
0.1
0.1
1745FS–ATARM–18-Apr-06