MC9S08SE4MRL Freescale Semiconductor, MC9S08SE4MRL Datasheet - Page 25
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MC9S08SE4MRL
Manufacturer Part Number
MC9S08SE4MRL
Description
MCU 8BIT 4K FLASH 5V 28-DIP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Specifications of MC9S08SE4MRL
Core Processor
HCS08
Core Size
8-Bit
Speed
20MHz
Connectivity
LIN, SCI
Peripherals
LVD, POR, PWM
Number Of I /o
24
Program Memory Size
4KB (4K x 8)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.600", 15.24mm)
Processor Series
S08SE
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
SCI
Maximum Clock Frequency
20 MHz
Number Of Timers
2
Operating Supply Voltage
2.7 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08SE8
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
3.10
This section describes ac timing characteristics for each peripheral system.
3.10.1
Freescale Semiconductor
1
2
3
4
5
6
Num
Typical values are based on characterization data at V
This is the shortest pulse that is guaranteed to be recognized as a reset pin request. Shorter pulses are not guaranteed to
override reset requests from internal sources.
When any reset is initiated, internal circuitry drives the reset pin (if enabled, RSTPE = 1) low for about 34 cycles of t
To enter BDM mode following a POR, BKGD/MS should be held low during the power-up and for a hold time of t
rises above V
This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or
may not be recognized. In stop mode, the synchronizer is bypassed so shorter pulses can be recognized in that case.
Timing is shown with respect to 20% V
1
2
3
4
5
6
7
8
9
C
D
D
D
D
D
D
D
D
C
AC Characteristics
Control Timing
Bus frequency (t
Internal low power oscillator period
External reset pulse width
Reset low drive
BKGD/MS setup time after issuing background
debug force reset to enter user or BDM modes
BKGD/MS hold time after issuing background debug
force reset to enter user or BDM modes
IRQ pulse width
Pin interrupt pulse width
Port rise and fall time —
Low output drive (PTxDS = 0) (load = 50 pF)
Port rise and fall time —
High output drive (PTxDS = 1) (load = 50 pF)
LVD
Asynchronous path
Synchronous path
Asynchronous path
Synchronous path
Slew rate control disabled (PTxSE = 0)
Slew rate control enabled (PTxSE = 1)
Slew rate control enabled (PTxSE = 1)
Slew rate control disabled (PTxSE = 0)
.
RESET PIN
3
cyc
= 1/f
5
5
2
2
Rating
MC9S08SE8 Series MCU Data Sheet, Rev. 3
Bus
2
DD
)
and 80% V
Table 13. Control Timing
Figure 19. Reset Timing
4
DD
DD
levels. Temperature range –40 °C to 125 °C.
6
= 5.0 V, 25 °C unless otherwise stated.
t
extrst
t
t
t
t
Symbol
ILIH,
ILIH,
Rise
Rise
t
t
t
MSSU
t
t
rstdrv
f
extrst
MSH
LPO
Bus
, t
, t
t
t
IHIL
IHIL
Fall
Fall
1.5 × t
1.5 × t
34 × t
Min
700
100
500
100
100
100
DC
—
—
cyc
cyc
cyc
Typical
Electrical Characteristics
40
75
11
35
—
—
—
—
—
—
—
—
1
1300
Max
10
—
—
—
—
—
—
—
—
MSH
after V
cyc
MHz
Unit
.
μs
ns
ns
ns
μs
ns
ns
ns
ns
DD
25