MC9S08SE4MWL Freescale Semiconductor, MC9S08SE4MWL Datasheet - Page 8

• Manufacturer Part Number: MC9S08SE4MWL
• Description: MCU 8BIT 4K FLASH 5V 28-SOIC
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08SE4MWL

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: LIN, SCI
• Peripherals: LVD, POR, PWM
• Number Of I /o: 24
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-SOIC (7.5mm Width)
• Processor Series: S08SE
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: SCI
• Maximum Clock Frequency: 20 MHz
• Number Of Timers: 2
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08SE8
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 10 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Electrical Characteristics
where:
T
θ
P
P
P
For most applications, P
(if P
Solving
where K is a constant pertaining to the particular part. K can be determined from
P
solving
3.4
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early
CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
During the device qualification ESD stresses were performed for the human body model (HBM), the
machine model (MM) and the charge device model (CDM).
A device is defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification. Complete DC parametric and functional testing is performed per the applicable device
specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
8
JA
A
D
int
I/O
D
= Ambient temperature, °C
= P
(at equilibrium) for a known T
= Package thermal resistance, junction-to-ambient, °C/W
= I
I/O
= Power dissipation on input and output pins — user-determined
int
DD
is neglected) is:
Equation 1
Equation 1
+ P
ESD Protection and Latch-Up Immunity
× V
I/O
Machine
Human
Model
DD
body
, Watts — chip internal power
and
and
Series resistance
Storage capacitance
Number of pulses per pin
Series resistance
Storage capacitance
Number of pulses per pin
Equation 2
I/O
Equation 2
<< P
Table 5. ESD and Latch-up Test Conditions
int
K = P
Description
MC9S08SE8 Series MCU Data Sheet, Rev. 3
A
and can be neglected. An approximate relationship between P
iteratively for any value of T
. Using this value of K, the values of P
for K gives:
D
P
T
× (T
D
J
= K ÷ (T
= T
A
+ 273°C) + θ
A
+ (P
J
+ 273°C)
D
× θ
Symbol
JA
R1
R1
JA
—
—
C
C
)
× (P
D
A
)
.
2
Value
1500
100
200
D
3
0
3
and T
Equation 3
J
can be obtained by
Freescale Semiconductor
Unit
pF
pF
—
—
Ω
Ω
by measuring
D
and T
Eqn. 1
Eqn. 2
Eqn. 3
J