MCF51JM32EVLD Freescale Semiconductor, MCF51JM32EVLD Datasheet - Page 16
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MCF51JM32EVLD
Manufacturer Part Number
MCF51JM32EVLD
Description
MCU 32K FLASH 16K SRAM 44-LQFP
Manufacturer
Freescale Semiconductor
Series
MCF51JMr
Datasheet
1.MCF51JM64VLD.pdf
(50 pages)
Specifications of MCF51JM32EVLD
Core Processor
Coldfire V1
Core Size
32-Bit
Speed
50MHz
Connectivity
CAN, I²C, SCI, SPI, USB OTG
Peripherals
LVD, PWM, WDT
Number Of I /o
33
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
44-LQFP
Processor Series
MCF51JM
Core
ColdFire V1
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
DEMOJM, DEMOFLEXISJMSD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Preliminary Electrical Characteristics
2.3
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and it is user-determined rather than
being controlled by the MCU design. To take P
pin voltage and V
(heavy loads), the difference between pin voltage and V
16
Thermal Characteristics
1
2
3
1
2
Supply voltage
Input voltage
Instantaneous maximum current
(applies to all port pins)
Maximum current into V
Storage temperature
Maximum junction temperature
Thermal resistance
80-pin LQFP
64-pin LQFP
64-pin QFP
44-pin LQFP
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive (V
voltages, then use the larger of the two resistance values.
All functional non-supply pins are internally clamped to V
Power supply must maintain regulation within operating V
operating maximum current conditions. If positive injection current (V
I
out of regulation. Ensure external V
current. This is the greatest risk when the MCU is not consuming power. Examples: if no system
clock is present or if the clock rate is low, which would reduce overall power consumption.
Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation
of other components on the board, and board thermal resistance.
Junction to Ambient Natural Convection
SS
DD
, the injection current may flow out of V
or V
Operating temperature range (packaged)
DD
and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current
1,2,3,4
Rating
MCF51JM128 ColdFire Microcontroller, Rev. 3
1
DD
,
Rating
2
Table 6. Absolute Maximum Ratings
,
3
Table 7. Thermal Characteristics
I/O
into account in power calculations, determine the difference between actual
Single pin limit
DD
load shunt current is greater than maximum injection
SS
or V
DD
and could result in external power supply going
DD
is small.
2s2p
2s2p
2s2p
2s2p
1s
1s
1s
1s
Symbol
T
V
V
I
T
I
DD
stg
DD
SS
D
In
J
DD
Symbol
and V
range during instantaneous and
θ
T
JA
A
DD
DD
–0.3 to V
) and negative (V
.
In
–0.3 to 5.8
–55 to 150
> V
–40 to 105
Value
120
150
±25
Value
DD
DD
52
40
65
47
54
40
69
48
) is greater than
+ 0.3
Freescale Semiconductor
SS
) clamp
°C/W
Unit
Unit
mA
mA
°C
°C
°C
V
V