MC9S08LL8CLF Freescale Semiconductor, MC9S08LL8CLF Datasheet - Page 11

• Manufacturer Part Number: MC9S08LL8CLF
• Description: IC MCU 8BIT 8K FLASH 48-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08LL8CLF

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LCD, LVD, POR, PWM, WDT
• Number Of I /o: 31
• Program Memory Size: 10KB (10K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Processor Series: S08LL
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 31
• Number Of Timers: 2
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: TWR-SER, TWR-ELEV, TWR-S08LL64, TWR-SENSOR-PAK, TWR-S08LL64-KIT, TWR-LCD
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 8 Channel
• Controller Family/series: HCS08
• No. Of I/o's: 31
• Ram Memory Size: 2KB
• Cpu Speed: 20MHz
• No. Of Timers: 2
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

3.4
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the
MCU design. To take P
voltage and V
pin current (heavy loads), the difference between pin voltage and V
The average chip-junction temperature (T
where:
For most applications, P
(if P
Solving
Freescale Semiconductor
I/O
T

P
P
P
JA
D
int
I/O
A
is neglected) is:
= Ambient temperature, C
= P
Equation 3-1
= Package thermal resistance, junction-to-ambient, C/W
= I
= Power dissipation on input and output pins — user determined
Thermal Characteristics
int
DD
SS
P
 V
or V
I/O
Operating temperature range
(packaged)
Maximum junction temperature
Thermal resistance
Thermal resistance
DD
Single-layer board
Four-layer board
DD
and
, Watts — chip internal power
I/O
I/O
and multiply by the pin current for each I/O pin. Except in cases of unusually high
64-pin LQFP
48-pin QFN
48-pin LQFP
64-pin LQFP
48-pin QFN
48-pin LQFP
into account in power calculations, determine the difference between actual pin
Equation 3-2
 P
Rating
K = P
int
MC9S08LL16 Series MCU Data Sheet, Rev. 6
and can be neglected. An approximate relationship between P
Table 5. Thermal Characteristics
D
P
T
 (T
D
for K gives:
J
= K  (T
J
= T
) in C can be obtained from:
A
+ 273C) + 
A
+ (P
J
D
+ 273C)
 
Symbol
T
JA


T
JM
JA
JA
JA
A
)
 (P
D
)
2
SS
–40 to 85
T
Value
L
or V
95
72
84
81
54
30
57
to T
H
DD
will be very small.
C/W
C/W
Electrical Characteristics
Unit
C
C
D
Eqn. 3-1
Eqn. 3-2
Eqn. 3-3
and T
11
J