MCHC908JK3ECPE Freescale Semiconductor, MCHC908JK3ECPE Datasheet - Page 147

• Manufacturer Part Number: MCHC908JK3ECPE
• Description: IC MCU 4K FLASH 8MHZ 20-DIP
• Manufacturer: Freescale Semiconductor
• Series: HC08r

Specifications of MCHC908JK3ECPE

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Peripherals: LED, LVD, POR, PWM
• Number Of I /o: 15
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.3 V
• Data Converters: A/D 12x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-DIP (0.300", 7.62mm)
• Processor Series: HC08JK
• Core: HC08
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 23
• Number Of Timers: 2
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Development Tools By Supplier: FSICEBASE, DEMO908JL16E, M68CBL05CE
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 12 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

Chapter 17
Mechanical Specifications
17.1 Introduction
This section gives the dimensions for:
The following figures show the latest package drawings at the time of this publication. To make sure that
you have the latest package specifications, contact your local Freescale Sales Office.
17.2 Package Dimensions
Refer to the following pages for detailed package dimensions.
Freescale Semiconductor
•
•
•
•
•
SEATING
PLANE
–T–
20-pin plastic dual in-line package (case #738)
20-pin small outline integrated circuit package (case #751D)
28-pin plastic dual in-line package (case #710)
28-pin small outline integrated circuit package (case #751F)
48-pin low-profile quad flat pack (case #932)
20
1
G
E
F
–A–
D
MC68HC908JL3E Family Data Sheet, Rev. 4
20 PL
10
11
0.25 (0.010)
N
20-Pin PDIP (Case #738)
B
K
M
C
T
A
M
J
L
20 PL
0.25 (0.010)
M
M
T
B
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD
Y14.5M, 1982.
FORMED PARALLEL.
FLASH.
DIM
M
A
B
C
D
E
F
G
K
L
N
J
1.010
0.240
0.150
0.015
0.050
0.008
0.020
0.110
MIN
0.050 BSC
0.100 BSC
0.300 BSC
0
INCHES
1.070
0.260
0.180
0.022
0.070
0.015
0.140
0.040
MAX
15
25.66
MILLIMETERS
MIN
6.10
3.81
0.39
1.27
0.21
2.80
0.51
1.27 BSC
2.54 BSC
7.62 BSC
0
MAX
27.17
6.60
4.57
0.55
1.77
0.38
3.55
1.01
15
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