S9S08DZ60F1MLF Freescale Semiconductor, S9S08DZ60F1MLF Datasheet - Page 139
S9S08DZ60F1MLF
Manufacturer Part Number
S9S08DZ60F1MLF
Description
MCU 60K FLASH MASK AUTO 48-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.DEMO9S08DZ60.pdf
(416 pages)
Specifications of S9S08DZ60F1MLF
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
48-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
S9S08DZ60F1MLF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
S9S08DZ60F1MLF
Manufacturer:
FREESCALE
Quantity:
20 000
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8.1.2
There are nine modes of operation for the MCG:
For details see
8.2
There are no MCG signals that connect off chip.
Freescale Semiconductor
•
•
•
•
•
•
•
•
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FLL Engaged Internal (FEI)
FLL Engaged External (FEE)
FLL Bypassed Internal (FBI)
FLL Bypassed External (FBE)
PLL Engaged External (PEE)
PLL Bypassed External (PBE)
Bypassed Low Power Internal (BLPI)
Bypassed Low Power External (BLPE)
Stop
External Signal Description
Modes of Operation
Section 8.4.1, “Operational
MC9S08DZ60 Series Data Sheet, Rev. 4
Modes.
Chapter 8 Multi-Purpose Clock Generator (S08MCGV1)
139
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