MC9S12XEQ384CAL Freescale Semiconductor, MC9S12XEQ384CAL Datasheet - Page 1209
![no-image](/images/manufacturer_photos/0/2/262/freescale_semiconductor_sml.jpg)
MC9S12XEQ384CAL
Manufacturer Part Number
MC9S12XEQ384CAL
Description
MCU 16BIT 384K FLASH 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet
1.MC9S12XEP768CAL.pdf
(1328 pages)
Specifications of MC9S12XEQ384CAL
Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
91
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
112-LQFP
Processor Series
S12XE
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
24 KB
Interface Type
CAN, SCI, SPI
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
91
Number Of Timers
25
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S12XEQ384CAL
Manufacturer:
FREESCAL
Quantity:
256
Company:
Part Number:
MC9S12XEQ384CAL
Manufacturer:
Freescale Semiconductor
Quantity:
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Part Number:
MC9S12XEQ384CAL
Manufacturer:
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Quantity:
20 000
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A.1.8
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
obtained from:
T
T
P
Θ
The total power dissipation can be calculated from:
P
Two cases with internal voltage regulator enabled and disabled must be considered:
Freescale Semiconductor
J
A
D
INT
JA
P
R
=
D
=
1. Internal voltage regulator disabled
2. Internal voltage regulator enabled
R
=
DSON
P
=
DSON
Junction Temperature, [°C ]
=
Ambient Temperature, [°C ]
=
Total Chip Power Dissipation, [W]
IO
Package Thermal Resistance, [°C/W]
P
P
Chip Internal Power Dissipation, [W]
IO
=
INT
=
is the sum of all output currents on I/O ports associated with V
∑
Power Dissipation and Thermal Characteristics
=
i
+
V
--------------------------------------- for outputs driven high
V
----------- - for outputs driven low
DD35
P
I
R
OL
OL
IO
DSON
I
OH
;
–
V
⋅
OH
I
P
IO i
INT
;
2
=
MC9S12XE-Family Reference Manual Rev. 1.23
P
I
INT
DD
⋅
=
V
DD
I
DDR
T
J
+
=
I
⋅
DDPLL
T
V
A
DDR
+
(
P
⋅
+
D
V
I
•
DDA
DDPLL
Θ
JA
⋅
)
V
DDA
+
I
DDA
⋅
V
DDX
DDA
Appendix A Electrical Characteristics
, whereby
J
) in °C can be
1209
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