R5F21238DFP#U0 Renesas Electronics America, R5F21238DFP#U0 Datasheet - Page 3

IC R8C/23 MCU FLASH 48-LQFP

R5F21238DFP#U0

Manufacturer Part Number
R5F21238DFP#U0
Description
IC R8C/23 MCU FLASH 48-LQFP
Manufacturer
Renesas Electronics America
Series
R8C/2x/23r
Datasheets

Specifications of R5F21238DFP#U0

Core Size
16/32-Bit
Program Memory Size
64KB (64K x 8)
Peripherals
POR, Voltage Detect, WDT
Core Processor
R8C
Speed
20MHz
Connectivity
CAN, I²C, LIN, SIO, SSU, UART/USART
Number Of I /o
41
Program Memory Type
FLASH
Ram Size
3K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
No. Of I/o's
41
Ram Memory Size
3KB
Cpu Speed
20MHz
No. Of Timers
4
Digital Ic Case Style
LQFP
Embedded Interface Type
CAN, I2C, UART
Rohs Compliant
Yes
Cpu Family
R8C
Device Core Size
16b
Frequency (max)
20MHz
Interface Type
I2C/UART
Total Internal Ram Size
3KB
# I/os (max)
41
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
3V
On-chip Adc
12-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
RCDK8C - KIT DEV EVAL FOR CAN R8C/23R0K521237S000BE - KIT DEV RSK R8C/23R0E521237CPE00 - EMULATOR COMPACT R8C/20/21/22/23
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
R5F21238DFP#U0R5F21238DFP
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Company:
Part Number:
R5F21238DFP#U0R5F21238DFP
Quantity:
48
Company:
Part Number:
R5F21238DFP#U0
Manufacturer:
REA
Quantity:
50
Company:
Part Number:
R5F21238DFP#U0
Manufacturer:
MOLEX
Quantity:
101
Company:
Part Number:
R5F21238DFP#U0
Manufacturer:
Renesas Electronics America
Quantity:
10 000
R8C/22 Group, R8C/23 Group
RENESAS MCU
Rev.2.00 Aug 20, 2008
REJ03B0097-0200
1.
This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged
in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of
instruction efficiency. With 1 Mbyte of address space, it is capable of executing instructions at high speed. This MCU
is equipped with one CAN module and suited to in-vehicle or FA networking.
Furthermore, the data flash (1 KB x 2 blocks) is embedded in the R8C/23 Group.
The difference between R8C/22 and R8C/23 Groups is only the existence of the data flash. Their peripheral functions
are the same.
1.1
Automotive, etc.
Overview
Applications
Page 1 of 48
REJ03B0097-0200
Aug 20, 2008
Rev.2.00

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