M30262F8GP#U3 Renesas Electronics America, M30262F8GP#U3 Datasheet - Page 39
M30262F8GP#U3
Manufacturer Part Number
M30262F8GP#U3
Description
IC M16C/TINY MCU FLASH 48LQFP
Manufacturer
Renesas Electronics America
Series
M16C™ M16C/Tiny/26r
Datasheets
1.M30622SAFPU5.pdf
(308 pages)
2.M30262F4GPU3.pdf
(41 pages)
3.M30262F4GPU3.pdf
(241 pages)
Specifications of M30262F8GP#U3
Core Processor
M16C/60
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, IEBus, SIO, UART/USART
Peripherals
DMA, WDT
Number Of I /o
38
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M30262F8GP#U3M30262F8GP#D3
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
M30262F8GP#U3M30262F8GP#D5
Manufacturer:
Renesas Electronics America
Quantity:
10 000
M16C/26 Group
Rev.1.00
REJ09B0176-0100Z
48P6Q-A
6. Package
EIAJ Package Code
LQFP48-P-77-0.50
12
1
13
48
2004.6.10
b
H
e
D
D
x
Recommended
page 37 of 37
M
37
24
y
JEDEC Code
36
25
–
F
Weight(g)
–
Detail F
A
Lead Material
Cu Alloy
L
1
Lp
L
Plastic 48pin 7 7mm body LQFP
Symbol
H
M
M
H
A
A
Lp
L
A3
b
A
D
E
I
b
c
e
L
y
x
I
2
1
2
D
E
1
2
D
E
2
Recommended Mount Pad
Dimension in Millimeters
Min
8.8
8.8
0.35
0.45
0
0.17
0.105
6.9
6.9
1.0
0
–
–
–
–
–
–
–
–
–
–
M
D
Nom
0.125
0.1
1.4
0.22
7.0
7.0
0.5
9.0
9.0
0.5
1.0
0.6
0.25
0.225
7.4
7.4
–
–
–
–
–
6. Package
Max
0.27
0.175
7.1
9.2
0.1
1.7
0.2
7.1
9.2
0.65
0.75
0.08
8
–
–
–
–
–
–
–
–