MCF5253VM140J Freescale Semiconductor, MCF5253VM140J Datasheet - Page 26
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MCF5253VM140J
Manufacturer Part Number
MCF5253VM140J
Description
IC MCU 2.1MIPS 140MHZ 225MAPBGA
Manufacturer
Freescale Semiconductor
Series
MCF525xr
Datasheets
1.MCF5253VM140J.pdf
(34 pages)
2.MCF5253VM140J.pdf
(8 pages)
3.MCF5253VM140J.pdf
(648 pages)
4.MCF5253VM140J.pdf
(2 pages)
Specifications of MCF5253VM140J
Core Processor
Coldfire V2
Core Size
32-Bit
Speed
140MHz
Connectivity
CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG
Peripherals
DMA, WDT
Program Memory Type
ROMless
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
1.08 V ~ 1.32 V
Data Converters
A/D 6x12b
Oscillator Type
External
Operating Temperature
-20°C ~ 70°C
Package / Case
225-MAPBGA
Processor Series
MCF525x
Core
ColdFire V2
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of I /o
-
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCF5253VM140J
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Package Information and Pinout
6.2
Figure 6
26
shows the package outline diagram for the MCF5253 processor.
Package Drawing
Notes:
1. All dimensions in millimeters.
2. Dimensioning and tolerancing per ASME Y14. 5M–1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crown of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 4
TOP VIEW
BOTTOM VIEW
Figure 6. MCF5253 Package Drawing
SIDE VIEW
Freescale Semiconductor