HD64F3687FPIV Renesas Electronics America, HD64F3687FPIV Datasheet - Page 7

• Manufacturer Part Number: HD64F3687FPIV
• Description: MCU 3/5V 56K I-TEMP PB-FREE 64-L
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300H Tinyr

Specifications of HD64F3687FPIV

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI
• Peripherals: PWM, WDT
• Number Of I /o: 45
• Program Memory Size: 56KB (56K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• For Use With: R0K436079S000BE - KIT DEV FOR H8/36079 W/COMPILER
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

This manual comprises the following items:
1. General Precautions on Handling of Product
2. Configuration of This Manual
3. Preface
4. Contents
5. Overview
6. Description of Functional Modules
When designing an application system that includes this LSI, take notes into account. Each section
includes notes in relation to the descriptions given, and usage notes are given, as required, as the
final part of each section.
7. List of Registers
8. Electrical Characteristics
9. Appendix
10. Main Revisions and Additions in this Edition (only for revised versions)
The list of revisions is a summary of points that have been revised or added to earlier versions.
This does not include all of the revised contents. For details, see the actual locations in this
manual.
11. Index
•
•
i) Feature
ii) Input/Output Pin
iii) Register Description
iv) Operation
v) Usage Note
The configuration of the functional description of each module differs according to the
module. However, the generic style includes the following items:
CPU and System-Control Modules
On-Chip Peripheral Modules
Configuration of This Manual
Rev.5.00 Nov. 02, 2005 Page v of xxxii