DF2268FA13 Renesas Electronics America, DF2268FA13 Datasheet - Page 139

IC H8S MCU FLASH 256K 100QFP

DF2268FA13

Manufacturer Part Number
DF2268FA13
Description
IC H8S MCU FLASH 256K 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheets

Specifications of DF2268FA13

Core Processor
H8S/2000
Core Size
16-Bit
Speed
13MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
67
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2268FA13
HD64F2268FA13

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2268FA13V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
2.2.35 (2)
LDC (LoaD to Control register)
Operation
<EAs>
Assembly-Language Format
LDC.B <EAs>, EXR
Operand Size
Byte
Description
This instruction loads the source operand contents into the extended control register (EXR).
No interrupt requests, including NMI, are accepted for three states after execution of this
instruction.
Available Registers
Rs: R0L to R7L, R0H to R7H
Operand Format and Number of States Required for Execution
Notes
Immediate
Register direct
Addressing
Mode
EXR
LDC (B)
Mnemonic
LDC.B
LDC.B
#xx:8, EXR
Operands
Rs, EXR
1st byte
0
0
1
3
Condition Code
H: Previous value remains unchanged.
N: Previous value remains unchanged.
Z: Previous value remains unchanged.
V: Previous value remains unchanged.
C: Previous value remains unchanged.
2nd byte
4
1
Instruction Format
Rev. 4.00 Feb 24, 2006 page 123 of 322
I
rs
1
UI H
Section 2 Instruction Descriptions
3rd byte
0
U
7
N
4th byte
REJ09B0139-0400
IMM
Z
— —
V
Load EXR
States
No. of
C
2
1

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