DF2376VFQ33V Renesas Electronics America, DF2376VFQ33V Datasheet - Page 869

• Manufacturer Part Number: DF2376VFQ33V
• Description: IC H8S/2376 MCU FLASH 144LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2376VFQ33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 97
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 30K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 6x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

16.5
There are six interrupt requests in this module; transmit data empty, transmit end, receive data full,
NACK detection, STOP recognition, and arbitration lost. Table 16.3 shows the contents of each
interrupt request.
Table 16.3 Interrupt Requests
Interrupt Request
Transmit Data Empty
Transmit End
Receive Data Full
STOP Recognition
NACK Detection
Arbitration Lost
Interrupt exception handling is performed when the interrupt conditions listed in table 16.3 are set
to 1 and the CPU is ready to accept interrupts. During exception handling, the interrupt sources
should be cleared. Note, however, that TDRE and TEND are automatically cleared by writing
transmit data to ICDRT, and RDRF is automatically cleared by reading data from ICDRR. In
particular, if TDRE is set at the same time transmit data is written to ICDRT, and then TDRE is
cleared again, an extra byte of data may be transmitted.
Interrupt Request
TXI
Abbreviation
TEI
RXI
STPI
NAKI
Interrupt Condition
(TDRE=1)
(TEND=1)
(RDRF=1)
(STOP=1)
{(NACKF=1)+(AL=1)}
Section 16 I
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•
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(STIE=1)
Rev.7.00 Mar. 18, 2009 page 801 of 1136
(TIE=1)
(TEIE=1)
(RIE=1)
2
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C Bus Interface 2 (IIC2) (Option)
(NAKIE=1)
REJ09B0109-0700