MAXQ610A-0000+ Maxim Integrated Products, MAXQ610A-0000+ Datasheet - Page 4
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MAXQ610A-0000+
Manufacturer Part Number
MAXQ610A-0000+
Description
IC MCU 16BIT 64K IR MOD 32TQFN
Manufacturer
Maxim Integrated Products
Series
MAXQ™r
Datasheets
1.MAXQ610A-0000.pdf
(28 pages)
2.MAXQ610A-0000.pdf
(29 pages)
3.MAXQ610A-0000.pdf
(23 pages)
Specifications of MAXQ610A-0000+
Core Processor
RISC
Core Size
16-Bit
Speed
12MHz
Connectivity
SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
Number Of I /o
20
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.7 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
32-TQFN Exposed Pad
Processor Series
MAXQ610
Core
RISC
Data Bus Width
16 bit
Data Ram Size
2 KB
Interface Type
SPI, USART
Maximum Clock Frequency
12 MHz
Number Of Timers
4
Operating Supply Voltage
1.7 V to 3.6 V
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
0 C
Controller Family/series
MAXQ
No. Of I/o's
24
Ram Memory Size
2048Byte
Cpu Speed
12MHz
No. Of Timers
2
Embedded Interface Type
JTAG, SPI, USART
Rohs Compliant
Yes
Number Of Programmable I/os
32
Development Tools By Supplier
MAXQ610-KIT
Package
32TQFN EP
Family Name
MAXQ
Maximum Speed
12 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
90-M6800+B01
16-Bit Microcontroller with Infrared Module
ABSOLUTE MAXIMUM RATINGS
Voltage Range on V
Voltage Range on Any Lead with Respect
Operating Temperature Range...............................0°C to +70°C
RECOMMENDED DC OPERATING CONDITIONS
(V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
4
Supply Voltage
1.8V Internal Regulator
Power-Fail Warning Voltage for
Supply (Note 2)
Power-Fail Reset Voltage
(Note 3)
Power-On Reset Voltage
RAM Data-Retention Voltage
Active Current (Note 5)
Stop-Mode Current
Current Consumption During
Power-Fail
Power Consumption During
Power-On Reset
Stop-Mode Resume Time
Power-Fail Monitor Startup Time
Power-Fail Warning Detection
Time
Input Low Voltage for IRTX,
IRRX, RESET, and All Port Pins
Input High Voltage for IRTX,
IRRX, RESET, and All Port Pins
Input Hysteresis (Schmitt)
Input Low Voltage for HFXIN
DD
to GND except V
_______________________________________________________________________________________
= V
RST
PARAMETER
to 3.6V, T
DD .....................................
DD
A
with Respect to GND .......-0.3V to +3.6V
= 0°C to +70°C.) (Note 1)
SYMBOL
V
t
V
PRM_ON
IL_HFXIN
V
V
V
V
I
REG18
V
I
t
I
V
DD_1
t
POR
V
I
I
PFW
V
IHYS
POR
PFR
PFW
DRV
RST
ON
DD
S1
S2
IH
-0.3V to (V
IL
Monitors V
Monitors V
Monitors V
(Note 4)
Sysclk = 12MHz
Power-Fail Off
Power-Fail On
(Notes 4, 6)
(Note 7)
(Note 4)
(Notes 4, 8)
DD
+ 0.5V)
DD
DD
DD
CONDITIONS
Storage Temperature Range .............................-65°C to +150°C
Soldering Temperature...........................Refer to the IPC/JEDEC
T
T
T
T
A
A
A
A
= +25°C
= 0°C to +70°C
= +25°C
= 0°C to +70°C
0.7 x
V
GND
GND
1.62
1.75
1.64
MIN
V
1.0
1.0
[(3 x I
10
RST
DD
(I
375 + 8192t
S1
S2
+ I
) + ((PCI - 3) x
NANO
TYP
1.67
0.15
0.15
27.6
100
300
1.8
1.8
2.5
22
J-STD-020 Specification.
))]/PCI
HFXIN
MAX
0.3 x
0.3 x
1.98
1.85
1.70
1.45
3.75
150
V
V
V
3.6
2.0
31
38
8
DD
DD
DD
UNITS
mA
mV
μA
μA
nA
μs
μs
μs
V
V
V
V
V
V
V
V
V