PIC16C57/JW Microchip Technology, PIC16C57/JW Datasheet - Page 179
![IC MCU OTP 2KX12 28CDIP](/photos/7/29/72984/150-28-cdip_sml.jpg)
PIC16C57/JW
Manufacturer Part Number
PIC16C57/JW
Description
IC MCU OTP 2KX12 28CDIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Specifications of PIC16C57/JW
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
20
Program Memory Size
3KB (2K x 12)
Program Memory Type
EPROM, UV
Ram Size
72 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 6.25 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
28-CDIP (0.300", 7.62mm) Window
For Use With
XLT28XP - SOCKET TRANSITION ICE 28DIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
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28-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
2002 Microchip Technology Inc.
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45
E1
E
Dimension Limits
h
Units
A2
A1
E1
E
D
B
n
p
A
h
L
c
2
1
D
L
MIN
Preliminary
.093
.088
.004
.394
.288
.695
.010
.016
.009
.014
0
0
0
A1
INCHES*
A
NOM
.050
.099
.008
.407
.295
.704
.020
.033
.017
.091
.011
28
12
12
4
MAX
.104
.094
.012
.420
.299
.712
.029
.050
.013
.020
15
15
8
MIN
17.65
10.01
2.36
2.24
0.10
0.25
0.23
0.36
7.32
0.41
0
0
0
MILLIMETERS
NOM
10.34
17.87
PIC16C5X
1.27
2.50
0.20
7.49
0.50
0.84
0.28
0.42
2.31
28
12
12
4
DS30453D-page 177
MAX
A2
10.67
18.08
2.64
2.39
0.30
7.59
0.74
1.27
0.33
0.51
15
15
8
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