PIC16C662-10I/PT Microchip Technology, PIC16C662-10I/PT Datasheet - Page 93
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PIC16C662-10I/PT
Manufacturer Part Number
PIC16C662-10I/PT
Description
IC MCU OTP 4KX14 COMP 44TQFP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Specifications of PIC16C662-10I/PT
Core Processor
PIC
Core Size
8-Bit
Speed
10MHz
Peripherals
Brown-out Detect/Reset, LED, POR, WDT
Number Of I /o
33
Program Memory Size
7KB (4K x 14)
Program Memory Type
OTP
Ram Size
176 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
44-TQFP, 44-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16C662-10I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
12.2
D001
D002*
D003
D004*
D005
D010
D010A
D015
D016
D017
D021
D021
Note 1: This is the limit to which V
Param
1996 Microchip Technology Inc.
No.
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25 C, unless otherwise stated. These parameters are for design guidance only
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be
5: The
and are not tested.
DC Characteristics:
V
V
V
S
V
I
I
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all I
OSC1=external square wave, from rail to rail; all I/O pins tristated, pulled to V
MCLR = V
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
estimated by the formula Ir = V
added to the base I
DD
PD
I
I
I
I
DD
DR
POR
VDD
BOR
BOR
COMP
VREF
WDT
Sym
current is the additional current consumed when this peripheral is enabled. This current should be
Standard Operating Conditions (unless otherwise stated)
Operating temperature
DD
Supply Voltage
RAM Data Retention
Voltage
V
ensure internal Power-on
Reset signal
V
Power-on Reset signal
Brown-out Reset Voltage
Supply Current
Module Differential Current
Power-down Current
DD
DD
; WDT enabled/disabled as specified.
Brown-out Reset Current
Comparator Current for
each Comparator
V
WDT Current
start voltage to
rise rate to ensure internal
REF
Characteristic
(1)
DD
Current
or I
PD
DD
PIC16LC641/642/661/662-04 (Commercial, Industrial)
DD
(2)
measurement.
can be lowered in SLEEP mode without losing RAM data.
measurements in active operation mode are:
DD
(3)
/2Rext (mA) with Rext in k .
–40 C
0 C
(5)
Preliminary
PIC16C64X & PIC16C66X
0.05
Min
3.0
1.5
3.7
T
T
–
–
–
–
–
–
–
–
A
A
+85 C
+70 C
Typ† Max Units
22.5
V
350
4.0
2.0
6.0
0.9
–
–
–
–
–
SS
425
100
300
6.0
4.3
3.8
48
20
–
–
–
5
for industrial and
commercial
V/ms See section on Power-on Reset for
mA
V
V
V
V
A
A
A
A
A
A
XT, RC, and LP osc configuration
Device in SLEEP mode
See section on Power-on Reset for
details
details
BODEN configuration bit is clear
XT and RC osc configuration
F
WDT disabled
LP osc configuration
F
WDT disabled
BODEN bit is clear, V
V
V
V
V
OSC
OSC
DD
DD
DD
DD
= 3.0V
= 3.0V
= 3.0V
= 3.0V, WDT disabled
DD
= 4.0 MHz, V
= 32 kHz, V
,
Conditions
(4)
DD
DS30559A-page 93
DD
DD
= 3.0V,
DD
= 3.0V,
or V
= 5.0V
SS
.