PIC16LC554-04E/SO Microchip Technology, PIC16LC554-04E/SO Datasheet - Page 93
![IC MCU OTP 512X14 18SOIC](/photos/6/76/67656/150-18-soic_sml.jpg)
PIC16LC554-04E/SO
Manufacturer Part Number
PIC16LC554-04E/SO
Description
IC MCU OTP 512X14 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheet
1.PIC16C554-04P.pdf
(108 pages)
Specifications of PIC16LC554-04E/SO
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
13
Program Memory Size
896B (512 x 14)
Program Memory Type
OTP
Ram Size
80 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
18-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
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18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
2002 Microchip Technology Inc.
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-051
B
c
p
n
45°
β
Dimension Limits
E1
E
h
Units
A2
E1
A1
A
E
D
B
n
p
h
L
φ
c
α
β
2
1
MIN
Preliminary
L
.093
.088
.004
.394
.446
.010
.016
.009
.014
D
.291
0
0
0
φ
INCHES*
NOM
.050
.099
.008
.407
.295
.454
.020
.033
.017
.091
.011
A
18
12
12
A1
4
MAX
.104
.094
.012
.420
.299
.462
.029
.050
.012
.020
15
15
8
MIN
11.33
10.01
2.36
2.24
0.10
7.39
0.25
0.23
0.36
0.41
0
0
0
MILLIMETERS
PIC16C55X
NOM
10.34
11.53
1.27
2.50
0.20
7.49
0.50
0.84
0.27
0.42
2.31
18
12
12
4
α
MAX
DS40143D-page 91
10.67
11.73
A2
2.64
2.39
0.30
7.59
0.74
1.27
0.30
0.51
15
15
8
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