PIC18C252-E/SP Microchip Technology, PIC18C252-E/SP Datasheet - Page 291
PIC18C252-E/SP
Manufacturer Part Number
PIC18C252-E/SP
Description
IC MCU OTP 16KX16 A/D 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Cr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16C770-ISO.pdf
(8 pages)
3.PIC18C242-ISO.pdf
(305 pages)
4.PIC18C242-ISO.pdf
(12 pages)
Specifications of PIC18C252-E/SP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
32KB (16K x 16)
Program Memory Type
OTP
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
PIC18C252E/SP
- PIC16F616T-ISL PDF datasheet
- PIC16C770-ISO PDF datasheet #2
- PIC18C242-ISO PDF datasheet #3
- PIC18C242-ISO PDF datasheet #4
- Current page: 291 of 305
- Download datasheet (6Mb)
APPENDIX E:
A detailed discussion of the differences between the
mid-range MCU devices (i.e., PIC16CXXX) and the
enhanced devices (i.e., PIC18CXXX) is provided in
AN716, “Migrating Designs from PIC16C74A/74B to
PIC18C442.” The changes discussed, while device
specific, are generally applicable to all mid-range to
enhanced device migrations.
This Application Note is available as Literature Number
DS00716.
2001 Microchip Technology Inc.
MIGRATION FROM
MID-RANGE TO
ENHANCED DEVICES
APPENDIX F:
A detailed discussion of the migration pathway and dif-
ferences between the high-end MCU devices (i.e.,
PIC17CXXX)
PIC18CXXX) is provided in AN726, “PIC17CXXX to
PIC18CXXX Migration.” This Application Note is avail-
able as Literature Number DS00726.
and
the
MIGRATION FROM
HIGH-END TO
ENHANCED DEVICES
PIC18CXX2
enhanced
DS39026C-page 289
devices
(i.e.,
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