PIC16LC770-E/SO Microchip Technology, PIC16LC770-E/SO Datasheet - Page 201
![IC MCU OTP 2KX14 A/D PWM 20SOIC](/photos/6/64/66480/150-20-soic_sml.jpg)
PIC16LC770-E/SO
Manufacturer Part Number
PIC16LC770-E/SO
Description
IC MCU OTP 2KX14 A/D PWM 20SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Specifications of PIC16LC770-E/SO
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
15
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
OTP
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 6x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
20-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
PIC16LC770E/SO
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17.2
2002 Microchip Technology Inc.
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
n
E1
E
eB
Dimension Limits
2
1
§
D
c
Units
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
MIN
A1
A
.140
.115
.015
.300
.240
.890
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.898
.130
.012
.058
.018
.370
18
10
10
B
B1
PIC16C717/770/771
MAX
.170
.145
.325
.260
.905
.135
.015
.070
.022
.430
15
15
MIN
22.61
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
NOM
p
22.80
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
18
10
10
DS41120B-page 199
MAX
A2
L
22.99
10.92
3.68
8.26
6.60
3.43
0.38
1.78
0.56
4.32
15
15
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