AT91R40807-33AU Atmel, AT91R40807-33AU Datasheet - Page 4

IC ARM7 MCU 100TQFP

AT91R40807-33AU

Manufacturer Part Number
AT91R40807-33AU
Description
IC ARM7 MCU 100TQFP
Manufacturer
Atmel
Series
AT91SAMr

Specifications of AT91R40807-33AU

Core Processor
ARM7
Core Size
16/32-Bit
Speed
33MHz
Connectivity
EBI/EMI, UART/USART
Peripherals
WDT
Number Of I /o
32
Program Memory Type
ROMless
Ram Size
136K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT91R40807-33AU
Manufacturer:
ATMEL
Quantity:
2 100
Part Number:
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Manufacturer:
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Quantity:
10 000
Thermal and
Reliability
Considerations
Thermal Data
Reliability Data
4
AT91R40807
In Table 4, the device lifetime is estimated with the MIL-217 standard in the “moderately con-
trolled” environmental model (this model is described as corresponding to an installation in a
permanent rack with adequate cooling air), depending on the device Junction Temperature.
(For details see the section “Junction Temperature” on page 5.)
Note that the user must be extremely cautious with this MTBF calculation: as the MIL-217
model is pessimistic with respect to observed values due to the way the data/models are
obtained (test under severe conditions). The life test results that have been measured are
always better than the predicted ones.
Table 4. MTBF Versus Junction Temperature
Table 5 summarizes the thermal resistance data related to the package of interest
Table 5. Thermal Resistance Data
The number of gates and the device die size are provided for the user to calculate reliability
data with another standard and/or in another environmental model.
Table 6. Reliability Data
Symbol
θ
θ
Parameter
Number of Logic Gates
Number of Memory Gates
Device Die Size
JA
JC
=
Junction Temperature (T
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
100
125
150
175
J
) (°C)
Condition
Still Air
Estimated Lifetime (MTBF) (Year)
7,006
Data
59.8
272
TQFP100
TQFP100
Package
13
7
4
2
K gates
K gates
Typ
6.4
40
mm
Unit
1367C–01/02
2
Units
°C/W

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