MC68HC711E9CFN3 Freescale Semiconductor, MC68HC711E9CFN3 Datasheet - Page 256
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MC68HC711E9CFN3
Manufacturer Part Number
MC68HC711E9CFN3
Description
IC MCU 3MHZ 12K OTP 52-PLCC
Manufacturer
Freescale Semiconductor
Series
HC11r
Specifications of MC68HC711E9CFN3
Core Processor
HC11
Core Size
8-Bit
Speed
3MHz
Connectivity
SCI, SPI
Peripherals
POR, WDT
Number Of I /o
38
Program Memory Size
12KB (12K x 8)
Program Memory Type
OTP
Eeprom Size
512 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
52-PLCC
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC68HC711E9CFN3
Manufacturer:
FREESCAL
Quantity:
5 530
Company:
Part Number:
MC68HC711E9CFN3
Manufacturer:
YAGEO
Quantity:
460 000
Company:
Part Number:
MC68HC711E9CFN3
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC68HC711E9CFN3
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
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Mechanical Data
12.4 52-Pin Windowed Ceramic-Leaded Chip Carrier (Case 778B)
Technical Data
256
C
J
G
0.51 (0.020)
-A-
R
S
F
M
T
A
S
B
N
D
K
S
H
52 PL
0.18 (0.007)
-B-
0.51 (0.020)
-T-
0.15 (0.006)
Mechanical Data
SEATING
PLANE
M
M
T
T
A
A
S
S
B
B
S
S
NOTES:
1.
2.
3.
4.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION R AND N DO NOT INCLUDE
GLASS PROTRUSION. GLASS PROTRUSION
TO BE 0.25 (0.010) MAXIMUM.
ALL DIMENSIONS AND TOLERANCES
INCLUDE LEAD TRIM OFFSET AND LEAD
FINISH.
DIM
A
B
C
D
G
H
K
N
R
F
J
S
0.785
0.785
0.165
0.017
0.026
0.090
0.006
0.035
0.735
0.735
0.690
MIN
0.050 BSC
INCHES
M68HC11E Family — Rev. 3.2
0.795
0.795
0.200
0.021
0.032
0.130
0.010
0.045
0.756
0.756
0.730
MAX
19.94
19.94
18.67
18.67
17.53
MILLIMETERS
MIN
4.20
0.44
0.67
2.29
0.16
0.89
1.27 BSC
20.19
20.19
19.20
19.20
18.54
MAX
5.08
0.53
0.81
3.30
0.25
1.14
MOTOROLA
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