MC68HC711E9CFN3 Freescale Semiconductor, MC68HC711E9CFN3 Datasheet - Page 14
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MC68HC711E9CFN3
Manufacturer Part Number
MC68HC711E9CFN3
Description
IC MCU 3MHZ 12K OTP 52-PLCC
Manufacturer
Freescale Semiconductor
Series
HC11r
Specifications of MC68HC711E9CFN3
Core Processor
HC11
Core Size
8-Bit
Speed
3MHz
Connectivity
SCI, SPI
Peripherals
POR, WDT
Number Of I /o
38
Program Memory Size
12KB (12K x 8)
Program Memory Type
OTP
Eeprom Size
512 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
52-PLCC
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC68HC711E9CFN3
Manufacturer:
FREESCAL
Quantity:
5 530
Company:
Part Number:
MC68HC711E9CFN3
Manufacturer:
YAGEO
Quantity:
460 000
Company:
Part Number:
MC68HC711E9CFN3
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC68HC711E9CFN3
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
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General Description
1.3 Structure
See
the table accompanying
1.4 Pin Descriptions
M68HC11 E-series MCUs are available packaged in:
Most pins on these MCUs serve two or more functions, as described in the following paragraphs. Refer
to
assignments for the PLCC/CLCC, QFP, TQFP, SDIP, and DIP packages.
14
Figure
•
•
•
•
•
•
•
•
•
Figure 1-1
Computer operating properly (COP) watchdog system
38 general-purpose input/output (I/O) pins:
–
–
–
Several packaging options:
–
–
–
–
–
–
52-pin plastic-leaded chip carrier (PLCC)
52-pin windowed ceramic leaded chip carrier (CLCC)
52-pin plastic thin quad flat pack, 10 mm x 10 mm (TQFP)
64-pin quad flat pack (QFP)
48-pin plastic dual in-line package (DIP), MC68HC811E2 only
56-pin plastic shrink dual in-line package, .070-inch lead spacing (SDIP)
1-2,
16 bidirectional I/O pins
11 input-only pins
11 output-only pins
52-pin plastic-leaded chip carrier (PLCC)
52-pin windowed ceramic leaded chip carrier (CLCC)
52-pin plastic thin quad flat pack, 10 mm x 10 mm (TQFP)
64-pin quad flat pack (QFP)
48-pin plastic dual in-line package (DIP), MC68HC811E2 only
56-pin plastic shrink dual in-line package, .070-inch lead spacing (SDIP)
Figure
for a functional diagram of the E-series MCUs. Differences among devices are noted in
1-3,
Figure
Figure
1-1.
1-4,
M68HC11E Family Data Sheet, Rev. 5.1
Figure
1-5, and
Figure 1-6
which show the M68HC11 E-series pin
Freescale Semiconductor
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