MC9S12D64MPV Freescale Semiconductor, MC9S12D64MPV Datasheet - Page 8

• Manufacturer Part Number: MC9S12D64MPV
• Description: IC MCU 64K FLASH 25MHZ 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12D64MPV

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I²C, SCI, SPI
• Peripherals: PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 112-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

MC9S12DJ64 Device User Guide — V01.20
6.1
6.1.1
6.2
6.2.1
6.3
6.3.1
6.4
6.5
6.5.1
6.6
Section 7 Clock and Reset Generator (CRG) Block Description
7.1
Section 8 Oscillator (OSC) Block Description
8.1
Section 9 Enhanced Capture Timer (ECT) Block Description
Section 10 Analog to Digital Converter (ATD) Block Description
Section 11 Inter-IC Bus (IIC) Block Description
Section 12 Serial Communications Interface (SCI) Block Description
Section 13 Serial Peripheral Interface (SPI) Block Description
Section 14 J1850 (BDLC) Block Description
Section 15 Pulse Width Modulator (PWM) Block Description
Section 16 Flash EEPROM 64K Block Description
Section 17 EEPROM 1K Block Description
Section 18 RAM Block Description
Section 19 MSCAN Block Description
8
CPU12 Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
HCS12 Module Mapping Control (MMC) Block Description . . . . . . . . . . . . . . . . . . . . . .77
HCS12 Multiplexed External Bus Interface (MEBI) Block Description . . . . . . . . . . . . . .77
HCS12 Interrupt (INT) Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
HCS12 Background Debug (BDM) Block Description . . . . . . . . . . . . . . . . . . . . . . . . . .78
HCS12 Breakpoint (BKP) Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
Device-specific information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
Device-specific information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
Device-specific information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
Device-specific information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
Device-specific information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
Device-specific information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78