HD64F2633TE25 Renesas Electronics America, HD64F2633TE25 Datasheet - Page 142

IC H8S MCU FLASH 256K 120-TQFP

HD64F2633TE25

Manufacturer Part Number
HD64F2633TE25
Description
IC H8S MCU FLASH 256K 120-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheet

Specifications of HD64F2633TE25

Core Processor
H8S/2600
Core Size
16-Bit
Speed
25MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
73
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
120-TQFP, 120-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Section 2 Instruction Descriptions
2.2.35 (4)
LDC (LoaD to Control register)
Operation
(EAs)
Assembly-Language Format
LDC.W <EAs>, EXR
Operand Size
Word
Description
This instruction loads the source operand contents into the extended control register (EXR).
Although EXR is a byte register, the source operand is word size. The contents of the even address
are loaded into EXR.
No interrupt requests, including NMI, are accepted for three states after execution of this
instruction.
Available Registers
ERs: ER0 to ER7
Rev. 4.00 Feb 24, 2006 page 126 of 322
REJ09B0139-0400
EXR
LDC (W)
Condition Code
H: Previous value remains unchanged.
N: Previous value remains unchanged.
Z: Previous value remains unchanged.
V: Previous value remains unchanged.
C: Previous value remains unchanged.
I
UI H
U
N
Z
— —
V
Load EXR
C

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