MC68376BGMAB20 Freescale Semiconductor, MC68376BGMAB20 Datasheet - Page 318

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MC68376BGMAB20

Manufacturer Part Number
MC68376BGMAB20
Description
IC MCU 32BIT 8K ROM 160-QFP
Manufacturer
Freescale Semiconductor
Series
M683xxr
Datasheets

Specifications of MC68376BGMAB20

Core Processor
CPU32
Core Size
32-Bit
Speed
20MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
18
Program Memory Type
ROMless
Ram Size
7.5K x 8
Voltage - Supply (vcc/vdd)
4.75 V ~ 5.25 V
Data Converters
A/D 16x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
160-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68376BGMAB20
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
C-2
MOTOROLA
• An economical means of evaluating target systems incorporating M68HC16 and
• Expansion memory sockets for installing RAM, EPROM, or EEPROM.
• Background-mode operation, for detailed operation from a personal computer
• Integrated assembly/editing/evaluation/programming environment for easy de-
• As many as seven software breakpoints.
• Re-usable ICD hardware for your target application debug or control.
• Two RS-232C terminal input/output (I/O) ports for user evaluation of the serial
• Logic analyzer pod connectors.
• Port replacement unit (PRU) to rebuild I/O ports lost to address/data/control.
• On-board V
• On-board wire-wrap area.
M68300 HCMOS MCU devices.
platform without an on-board monitor.
velopment.
communication interface.
— Data RAM: 32K x 16, 128K x 16, or 512K x 16
— EPROM/EEPROM: 32K x 16, 64K x 16, 128K x 16, 256K x 16, or 512K x 16
— Fast RAM: 32K x 16 or 128K x 16
PP
(+12 VDC) generation for MCU and flash EEPROM programming.
DEVELOPMENT SUPPORT
USER’S MANUAL
MC68336/376

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