DF2338VFC25IV Renesas Electronics America, DF2338VFC25IV Datasheet - Page 99
DF2338VFC25IV
Manufacturer Part Number
DF2338VFC25IV
Description
MCU 3V 256K I-TEMP PB-FREE 144-Q
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of DF2338VFC25IV
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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2.9.3
The on-chip supporting modules are accessed in two states. The data bus is either 8 bits or 16 bits
wide, depending on the particular internal I/O register being accessed. Figure 2.16 shows the
access timing for the on-chip supporting modules. Figure 2.17 shows the pin states.
φ
Internal address bus
Read
access
Write
access
On-Chip Supporting Module Access Timing
Internal read signal
Internal data bus
Internal write signal
Internal data bus
Figure 2.16 On-Chip Supporting Module Access Cycle
T
1
Rev.4.00 Sep. 07, 2007 Page 67 of 1210
Bus cycle
Address
Write data
Read data
T
2
REJ09B0245-0400
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