MAC7101MAG40 Freescale Semiconductor, MAC7101MAG40 Datasheet - Page 10

• Manufacturer Part Number: MAC7101MAG40
• Description: IC MCU 32BIT FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MAC7xxxr

Specifications of MAC7101MAG40

• Core Processor: ARM7
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, I²C, SCI, SPI
• Peripherals: DMA, POR
• Number Of I /o: 112
• Program Memory Size: 544KB (544K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 32x8/10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Electrical Characteristics
3.6.1
Table 11. Thermal Resistance for Case Outline 983–02, 100 Lead 14x14 mm LQFP, 0.5 mm Pitch
Table 12. Thermal Resistance for Case Outline 987–01, 112 Lead 20x20 mm LQFP, 0.65 mm Pitch
Table 13. Thermal Resistance for Case Outline 918–03, 144 Lead 20x20 mm LQFP, 0.5 mm Pitch
Table 14. Thermal Resistance for Case Outline 1159A-01, 208 Lead 17x17 mm MAP BGA, 1.0 mm Pitch
Comments:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and junction temperature per JEDEC
10
Junction to Ambient (Natural Convection)
Junction to Ambient (Natural Convection)
Junction to Ambient (@ 200 ft./min.)
Junction to Ambient (@ 200 ft./min.)
Junction to Board
Junction to Case
Junction to Package Top
Junction to Ambient (Natural Convection)
Junction to Ambient (Natural Convection)
Junction to Ambient (@ 200 ft./min.)
Junction to Ambient (@ 200 ft./min.)
Junction to Board
Junction to Case
Junction to Package Top
Junction to Ambient (Natural Convection)
Junction to Ambient (Natural Convection)
Junction to Ambient (@ 200 ft./min.)
Junction to Ambient (@ 200 ft./min.)
Junction to Board
Junction to Case
Junction to Package Top
Junction to Ambient (Natural Convection)
Junction to Ambient (Natural Convection)
Junction to Ambient (@ 200 ft./min.)
Junction to Ambient (@ 200 ft./min.)
Junction to Board
Junction to Case
Junction to Package Top
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
of the board at the center lead. For fused lead packages, the adjacent lead is used.
JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
Thermal Resistance Simulation Details
Rating
Rating
Rating
Rating
MAC7100 Microcontroller Family Hardware Specifications, Rev. 1.2
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural Convection
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural Convection
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural Convection
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural Convection
Environment
Environment
Environment
Environment
Preliminary
Symbol
Symbol
Symbol
Symbol
R θJMA
R θJMA
R θJMA
R θJMA
R θJMA
R θJMA
R θJMA
R θJMA
R θJMA
R θJMA
R θJMA
R θJMA
R θJC
R θJC
R θJC
R θJA
R θJB
R θJA
R θJB
R θJA
R θJB
R θJB
R θJC
R θJA
Ψ JT
Ψ JT
Ψ JT
Ψ JT
Value
Value
Value
Value
42
34
35
30
22
42
34
35
30
22
46
29
38
26
19
44
34
37
29
18
7
2
7
2
7
2
7
2
Freescale Semiconductor
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
Unit
Unit
Comments
Comments
Comments
Comments
1,
1,
1,
1,
1,
1,
1,
1,
1,
1,
1,
1,
1,
1,
1,
1,
4
5
6
4
5
6
4
5
6
4
5
6
2
3
3
3
2
3
3
3
2
3
3
3
2
3
3
3