MC9S08DN60MLF Freescale Semiconductor, MC9S08DN60MLF Datasheet - Page 133

• Manufacturer Part Number: MC9S08DN60MLF
• Description: IC MCU 60K FLASH 2K RAM 48-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08DN60MLF

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 39
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 2K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 48-LQFP
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 53
• Number Of Timers: 8
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

8.1.2
There are nine modes of operation for the MCG:
For details see
8.2
There are no MCG signals that connect off chip.
Freescale Semiconductor
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FLL Engaged Internal (FEI)
FLL Engaged External (FEE)
FLL Bypassed Internal (FBI)
FLL Bypassed External (FBE)
PLL Engaged External (PEE)
PLL Bypassed External (PBE)
Bypassed Low Power Internal (BLPI)
Bypassed Low Power External (BLPE)
Stop
External Signal Description
Modes of Operation
Section 8.4.1, “Operational
MC9S08DN60 Series Data Sheet, Rev 3
Modes.
Chapter 8 Multi-Purpose Clock Generator (S08MCGV1)
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