MCF54452CVR200 Freescale Semiconductor, MCF54452CVR200 Datasheet - Page 46
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MCF54452CVR200
Manufacturer Part Number
MCF54452CVR200
Description
IC MPU 32BIT 200MHZ 360TEPBGA
Manufacturer
Freescale Semiconductor
Series
MCF5445xr
Datasheet
1.MCF54452CVR200.pdf
(48 pages)
Specifications of MCF54452CVR200
Core Processor
Coldfire V4
Core Size
32-Bit
Speed
200MHz
Connectivity
I²C, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, WDT
Number Of I /o
132
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.35 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
360-TEPBGA
Processor Series
MCF544x
Core
ColdFire V4
Data Bus Width
32 bit
Program Memory Size
16 KB
Data Ram Size
32 KB
Interface Type
I2C, SPI, SSI
Maximum Clock Frequency
66 MHz
Number Of Timers
8
Operating Supply Voltage
- 0.3 V to + 4 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
M54455EVB
Minimum Operating Temperature
- 40 C
On-chip Adc
16 bit, 16 Channel
On-chip Dac
16 bit, 16 Channel
Family Name
MCF5445X
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
200MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
3.3V
Operating Supply Voltage (max)
1.65/3.6V
Operating Supply Voltage (min)
1.35/3V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
360
Package Type
TEBGA
For Use With
M54455EVB - BOARD EVAL FOR MCF5445X
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCF54452CVR200
Manufacturer:
Freescale Semiconductor
Quantity:
135
Company:
Part Number:
MCF54452CVR200
Manufacturer:
FREESCAL
Quantity:
160
Revision History
9
Table 34
46
Rev. No.
0
1
2
3
4
5
6
summarizes revisions to this document.
Revision History
Sept 17, 2007 Initial public release.
Feb 15, 2008 Corrected VSS pin locations in MCF5445x signal information and muxing table for the 360 TEPBGA
Apr 12, 2009 Rescinded previous errata, the 256-pin devices do not contain the PCI bus controller:
Apr 27, 2009 In
Oct 15, 2009 In
May 1, 2008 In Family Configurations table, added PCI as feature on 256-pin devices. On these devices the
Dec 1, 2008 Changed “360PBGA” heading to “360 TEPBGA” in
Date
Updated FlexBus read and write timing diagrams and added two notes before them.
Change FB_A[23:0] to FB_A[31:0] in FlexBus read and write timing diagrams.
Added power consumption section.
In Absolute Maximum Ratings table, changed RTCV
In DC Electrical Specifications table:
Changed the following specs in
• Changed RTCV
• Changed High Impedance (Off-State) Leakage Current (I
• Minimum frequency of operation from — to 60MHz
• Maximum clock period from — to 16.67 ns
• In
• In
Table 2
Table 8
package: changed “...M9, M16, M17...” to “...M9–M14, M16...”
PCI_AD bus is limited to 24-bits.
+2.0”.
added footnote to this spec: “Worst-case tristate leakage current with only one I/O pin high. Since
all I/Os share power when high, the leakage current is distributed among them. With all I/Os high,
this spec reduces to ±2 μA min/max.“
signals shown as — for 256-pin devices.
from “0
Table
Figure
MCF5445x ColdFire
°
changed MCF54450VM180 to MCF54450CVM180 and changed it’s temperature entry
changed Input Leakage Current (I
4, in PCI_ADn signal section, added a separate row for each package, with PCI_ADn
to +70
5, changed the PCI_ADn pins to their alternative function, FB_An.
°
DD
C” to “–40
Table 34. Revision History
specification from 3.0–3.6 to 1.35–1.65.
®
Microprocessor Data Sheet, Rev. 6
°
to +85
Table
Summary of Changes
13:
°
C”
in
) from ±1.0 to ±2.5μA
Table
DD
specification from “-0.3 to +4.0” to “-0.5 to
6.
OZ
) specification from ±1 to ±10μA, and
Freescale Semiconductor