MC9S08DN32ACLH Freescale Semiconductor, MC9S08DN32ACLH Datasheet - Page 22

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MC9S08DN32ACLH

Manufacturer Part Number
MC9S08DN32ACLH
Description
IC MCU 32K FLASH 1.5K RAM 64LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheets

Specifications of MC9S08DN32ACLH

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
S08DN
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
I2C, SCI, SPI
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08DZ60
On-chip Adc
12 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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EXTAL
* The fixed frequency clock (FFCLK) is internally
synchronized to the bus clock and must not exceed one half
of the bus clock frequency.
Chapter 1 Device Overview
22
XOSC
MCG
1 kHZ
LPO
XTAL
MCGERCLK
MCGIRCLK
MCGFFCLK
MCGOUT
MCGLCLK
CPU
÷
÷
Figure 1-2. MC9S08DN60 System Clock Distribution Diagram
2
2
BUSCLK
RTC
MC9S08DN60 Series Data Sheet, Rev 3
COP
BDC
TPM1CLK
TPM1
FFCLK*
TPM2CLK
TPM2
ADC has min and max
frequency requirements.
See the ADC chapter
and electricals appendix
for details.
IIC
ADC
SCI1
Freescale Semiconductor
Flash and EEPROM have
frequency requirements
for program and erase
operation. See
the electricals appendix
for details.
FLASH
SPI
EEPROM

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