MCP6231-E/P Microchip Technology, MCP6231-E/P Datasheet - Page 35
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MCP6231-E/P
Manufacturer Part Number
MCP6231-E/P
Description
IC OPAMP 1.8V SNGL R-R 8DIP
Manufacturer
Microchip Technology
Specifications of MCP6231-E/P
Slew Rate
0.15 V/µs
Package / Case
8-DIP (0.300", 7.62mm)
Amplifier Type
General Purpose
Number Of Circuits
1
Output Type
Rail-to-Rail
Gain Bandwidth Product
300kHz
Current - Input Bias
1pA
Voltage - Input Offset
5000µV
Current - Supply
20µA
Current - Output / Channel
23mA
Voltage - Supply, Single/dual (±)
1.8 V ~ 6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Number Of Channels
1
Common Mode Rejection Ratio (min)
61 dB
Input Offset Voltage
5 mV
Input Bias Current (max)
1 pA
Operating Supply Voltage
3 V, 5 V
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
Through Hole
Shutdown
No
Supply Voltage (max)
6 V
Supply Voltage (min)
1.8 V
Technology
CMOS
Voltage Gain Db
110 dB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
-3db Bandwidth
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP6231-E/P
Manufacturer:
MICROCHIP
Quantity:
1 678
Part Number:
MCP6231-E/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
APPENDIX A:
Revision E (August 2009)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
Revision D (May 2008)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. Added
11. Replaced Section 5.0 “Design Aids” with
12. Updated
© 2009 Microchip Technology Inc.
Added the 2x3 TDFN package for MCP6232.
Updated the 2x3 DFN package information for
MCP6231.
Updated the “Temperature Characteristics”
table.
Updated Section 3.0 “Pin Descriptions”.
Updated the Package Outline Drawings in
Section 6.0 “Packaging Information”.
Updated the Product Identification Systems
section.
Changed Heading “Available Tools” to “Design
Aids”.
Design Aids: Name change for Mindi Simulator
Tool.
Package Types: Added DFN to MCP6231
Device.
Absolute
changes in this section.
Updated notes to Section 1.0 “Electrical
Characteristics”.
Added Test Circuits to Section 1.0 “Electrical
Characteristics”.
Corrected Figure 2-7.
Added
Numerous
Descriptions”.
Section 4.1.2 “Input Voltage and Current
Limits”,
Operation”.
additional information.
Information” with updated Package Outline
Drawings.
Figure
Section 4.1.1
Maximum
and
changes
2-19.
Section 6.0
REVISION HISTORY
Section 4.1.3
to
Ratings:
“Phase
Section 3.0
“Packaging
Reversal”,
Numerous
“Normal
“Pin
Revision C (March 2005)
The following is the list of modifications:
1.
2.
3.
4.
5.
Revision B (August 2004)
• Undocumented changes.
Revision A (March 2004)
• Original Release of this Document.
Added the MCP6234 quad op amp.
Corrected
Performance Curves”.
Added Section 3.0 “Pin Descriptions”.
Added new SC-70 package markings. Added
PDIP-14, SOIC-14, and TSSOP-14 packages
and corrected package marking information
(Section 6.0 “Packaging Information”).
Added Appendix A: “Revision History”.
plots
MCP6231/2/4
in
Section 2.0
DS21881E-page 35
“Typical