MCP6293-E/SN Microchip Technology, MCP6293-E/SN Datasheet - Page 22
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MCP6293-E/SN
Manufacturer Part Number
MCP6293-E/SN
Description
IC OPAMP 2.4V SNGL CS R-R 8SOIC
Manufacturer
Microchip Technology
Datasheets
1.PIC16F690DM-PCTLHS.pdf
(36 pages)
2.MCP6291T-EOT.pdf
(16 pages)
3.MCP6293T-ECH.pdf
(32 pages)
Specifications of MCP6293-E/SN
Slew Rate
7 V/µs
Amplifier Type
General Purpose
Number Of Circuits
1
Output Type
Rail-to-Rail
Gain Bandwidth Product
10MHz
Current - Input Bias
1pA
Voltage - Input Offset
3000µV
Current - Supply
1mA
Current - Output / Channel
25mA
Voltage - Supply, Single/dual (±)
2.4 V ~ 6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Op Amp Type
General Purpose
No. Of Amplifiers
1
Bandwidth
10MHz
Supply Voltage Range
2.4V To 5.5V
Amplifier Case Style
SOIC
No. Of Pins
8
Operating Temperature Range
-40°C To
Number Of Channels
1
Voltage Gain Db
110 dB
Common Mode Rejection Ratio (min)
70 dB
Input Offset Voltage
3 mV
Operating Supply Voltage
3 V, 5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Request inventory verification / Request inventory verification
-3db Bandwidth
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP6293-E/SN
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
MCP6293-E/SN
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
MCP6291/2/3/4/5
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS21812D-page 22
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
n
eB
E1
E
Dimension Limits
§
Units
2
1
eB
A2
A1
E1
B1
D
n
p
A
E
L
B
c
c
D
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
A
A1
.100
.155
.130
.313
.250
.373
.130
.012
.058
.018
.370
10
10
8
B1
B
MAX
.170
.145
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MIN
3.56
2.92
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
2004 Microchip Technology Inc.
NOM
2.54
3.94
3.30
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
8
p
A2
MAX
10.92
L
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
4.32
15
15