MCP6V02-E/SN Microchip Technology, MCP6V02-E/SN Datasheet - Page 5

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MCP6V02-E/SN

Manufacturer Part Number
MCP6V02-E/SN
Description
IC OPAMP AUTO-ZERO DUAL 8SOIC
Manufacturer
Microchip Technology
Datasheet

Specifications of MCP6V02-E/SN

Slew Rate
0.5 V/µs
Package / Case
8-SOIC (3.9mm Width)
Amplifier Type
Chopper (Zero-Drift)
Number Of Circuits
2
Output Type
Rail-to-Rail
Gain Bandwidth Product
1.3MHz
Current - Input Bias
1pA
Voltage - Input Offset
2µV
Current - Supply
300µA
Current - Output / Channel
22mA
Voltage - Supply, Single/dual (±)
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Number Of Channels
2
Common Mode Rejection Ratio (min)
130 dB
Input Offset Voltage
0.002 mV
Input Bias Current (max)
1 pA
Operating Supply Voltage
3 V, 5 V
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Shutdown
No
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V
Technology
CMOS
Voltage Gain Db
156 dB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
-3db Bandwidth
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP6V02-E/SN
Manufacturer:
Microchip
Quantity:
3 124
Part Number:
MCP6V02-E/SN
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
TABLE 1-3:
TABLE 1-4:
© 2008 Microchip Technology Inc.
Electrical Characteristics: Unless otherwise indicated, T
V
CS Pull-Down Resistor (MCP6V03)
CS Pull-Down Resistor
CS Low Specifications (MCP6V03)
CS Logic Threshold, Low
CS Input Current, Low
CS High Specifications (MCP6V03)
CS Logic Threshold, High
CS Input Current, High
CS Input High, GND Current per
amplifier
Amplifier Output Leakage, CS High I
CS Dynamic Specifications (MCP6V03)
CS Low to Amplifier Output On
Turn-on Time
CS High to Amplifier Output High-Z
Internal Hysteresis
Electrical Characteristics: Unless otherwise indicated, all limits are specified for: V
Temperature Ranges
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
Thermal Resistance, 8L-2x3 TDFN
Thermal Resistance, 8L-4x4 DFN
Thermal Resistance, 8L-SOIC
Note 1:
OUT
= V
2:
DD
Parameters
/2, V
Operation must not cause T
Measured on a standard JC51-7, four layer printed circuit board with ground plane and vias.
Parameters
L
= V
DIGITAL ELECTRICAL SPECIFICATIONS
TEMPERATURE SPECIFICATIONS
DD
/2, R
L
= 20 kΩ to V
O_LEAK
V
Sym
I
t
R
I
V
t
HYST
V
CSL
CSH
I
I
OFF
ON
SS
SS
J
PD
IH
IL
to exceed Maximum Junction Temperature specification (150°C).
L
, C
0.7V
Sym
L
θ
θ
θ
T
T
T
Min
V
JA
JA
JA
= 60 pF, and CS = GND (refer to
A
A
A
3
SS
DD
Min
V
-40
-40
-65
A
DD
0.25
Typ
-0.7
-2.3
= +25°C, V
20
11
10
5
5
/R
PD
Typ
150
41
44
0.3V
Max Units
V
100
DD
DD
DD
= +1.8V to +5.5V, V
Max
+125
+125
+150
pA
pA
µA
µA
pA
µs
µs
V
V
V
Figure 1-5
DD
Units
°C/W
°C/W
°C/W
CS = V
CS = V
CS = V
CS = V
CS = V
CS Low = V
V
CS High = V
V
°C
°C
°C
OUT
OUT
= +1.8V to +5.5V, V
= 0.9 V
= 0.1 V
MCP6V01/2/3
and
SS
DD
DD
DD
DD
(Note 1)
(Note 2)
SS
, V
, V
= GND, V
Figure
SS
DD
DD
DD
DD
DD
+0.3 V, G = +1 V/V,
Conditions
= 1.8V
= 5.5V
/2
– 0.3 V, G = +1 V/V,
/2
1-6).
Conditions
CM
SS
= V
= GND.
DS22058C-page 5
DD
/3,

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